APPARATUS AND METHODS TO REMOVE UNBONDED AREAS WITHIN BONDED SUBSTRATES USING LOCALIZED ELECTROMAGNETIC WAVE ANNEALING
    1.
    发明申请
    APPARATUS AND METHODS TO REMOVE UNBONDED AREAS WITHIN BONDED SUBSTRATES USING LOCALIZED ELECTROMAGNETIC WAVE ANNEALING 审中-公开
    使用局部化电磁波退火去除粘合衬底中的无粘结区域的装置和方法

    公开(公告)号:WO2017156195A1

    公开(公告)日:2017-09-14

    申请号:PCT/US2017/021458

    申请日:2017-03-08

    Abstract: An electromagnetic wave irradiation apparatus and methods to bond unbonded areas in a bonded pair of substrates are disclosed. The unbonded areas between the substrates are eliminated by thermal activation in the unbonded areas induced by electromagnetic wave irradiation having a wavelength selected to effect a phonon or electron excitation. A first substrate of the bonded pair of substrates absorbs the electromagnetic radiation and a portion of a resulting thermal energy transfers to an interface of the bonded pair of substrates at the unbonded areas with sufficient flux to cause opposite sides the first and second substrates to interact and dehydrate to form a bond (e.g., Si-O-Si bond).

    Abstract translation: 公开了一种电磁波照射设备和用于在粘合的一对基板中粘合未粘合区域的方法。 基片之间的未粘合区域通过在具有选定的波长的电磁波辐射引起的未粘合区域中的热活化而被消除,以实现声子或电子激发。 所述一对接合衬底中的第一衬底吸收电磁辐射,并且一部分产生的热能在未接合区域处传递至接合的一对衬底的界面,并具有足够的通量以引起第一和第二衬底的相对侧相互作用并且 脱水形成键(例如Si-O-Si键)。

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