公开(公告)号：AT265132T

公开(公告)日：2004-05-15

申请号：AT00311330

申请日：2000-12-18

Applicant: PACE MICRO TECH PLC

Inventor： BRISTOW ANTHONY ,  CROSS STEPHEN ,  WOODHOUSE DAVID ,  FULLER COLIN ,  STURGE DAVID

IPC: H01L23/367 ,  H05K7/20

Abstract: The invention relates to the provision of a cooling effect on components (6) of electrical apparatus which are mounted on an upper surface (8) of a printed circuit board (4) within a housing (2). The invention provides for the mounting of a material layer (12) which can absorb or otherwise dissipate heat and the invention allows the mounting of the said material (12) beneath the printed circuit board (4) within the housing (2) in position to provide improved cooling effect without contacting the components (6) themselves.