公开(公告)号：DE60234678D1

公开(公告)日：2010-01-21

申请号：DE60234678

申请日：2002-10-30

Applicant: PANASONIC CORP

Inventor： SUGAWA TOSHIO ,  TAKASE YOSHIHISA

IPC: H05K1/11 ,  H05K3/38 ,  H05K1/03 ,  H05K3/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46

Abstract: The present invention provides a circuit board in which peeling strength is prevented from decreasing and connection resistance to conductive material is prevented from increasing, though the contact area decreases when the circuit board has a copper foil. This circuit board has metal film (105) for covering a through hole on at least one surface of insulating substrate (101) having the through hole filled with conductive material (104). Uneven layer (1069 with a thickness of 5 mu m or more is formed on a surface of metal film (105), and a metal layer is formed on the opposite surface to uneven layer (106).