公开(公告)号：DE602006011710D1

公开(公告)日：2010-03-04

申请号：DE602006011710

申请日：2006-11-07

Applicant: PANASONIC CORP

Inventor： NAKAMURA TADASHI ,  ECHIGO FUMIO ,  HIRAI SHOGO ,  SUGAWA TOSHIO

IPC: H01L23/12 ,  H05K3/46

Abstract: A plurality of double-sided boards using a film are attached to each other with a paste coupling layer sandwiched therebetween. In the paste coupling layer, a conductive paste is filled into a through hole formed in provisionally hardened resin, which is hardened. At the same time, second wirings are electrically coupled to each other by using the hardened conductive paste filled in the through holes that have been previously formed in the paste coupling layer. Thus, it is possible to provide a thinned multilayer printed wiring board without using an adhesive.

公开(公告)号：DE60234678D1

公开(公告)日：2010-01-21

申请号：DE60234678

申请日：2002-10-30

Applicant: PANASONIC CORP

Inventor： SUGAWA TOSHIO ,  TAKASE YOSHIHISA

IPC: H05K1/11 ,  H05K3/38 ,  H05K1/03 ,  H05K3/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46

Abstract: The present invention provides a circuit board in which peeling strength is prevented from decreasing and connection resistance to conductive material is prevented from increasing, though the contact area decreases when the circuit board has a copper foil. This circuit board has metal film (105) for covering a through hole on at least one surface of insulating substrate (101) having the through hole filled with conductive material (104). Uneven layer (1069 with a thickness of 5 mu m or more is formed on a surface of metal film (105), and a metal layer is formed on the opposite surface to uneven layer (106).

公开(公告)号：JP2008306012A

公开(公告)日：2008-12-18

申请号：JP2007152301

申请日：2007-06-08

Applicant: Panasonic Corp ,  パナソニック株式会社

Inventor： SUGAWA TOSHIO ,  NAKAMURA SADASHI ,  IWAZAWA AYAKO

IPC: H05K1/02 ,  G03F1/42 ,  G03F9/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/40

Abstract: PROBLEM TO BE SOLVED: To recognize a position optically, by irradiating light to a concave portion or a convex portion of a via to be the reference for the alignment in a direction other than the surface of a substrate and vertical direction. SOLUTION: A conductor layer 6 is filled by plating in the via 3 provided penetrating through an insulating substrate 2 from the surface to reverse surface thereof. The region coinciding with a positioning marker of at least photomask in the conductor layer 6 of the via portion, achieves an optically recognizable concave portion or convex portion in the substrate. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：通过将光照射到作为基准的基准的基准的凹部或凸部，沿除了基板表面和垂直方向以外的方向进行光学识别。 解决方案：导体层6通过电镀被填充在穿过绝缘基板2的通孔3的表面到反面上。 与通孔部分的导体层6中的至少光掩模的定位标记重合的区域在基板中实现光学可识别的凹部或凸部。 版权所有（C）2009，JPO＆INPIT