公开(公告)号：WO2013181494A1

公开(公告)日：2013-12-05

申请号：PCT/US2013/043535

申请日：2013-05-31

Applicant: PANDUIT CORP.

Inventor： STRAKA, Frank ,  HAGAR, Melanie ,  BOLOURI-SARANSAR, Masud ,  NORDIN, Ronald A.

IPC: H01R13/6466 ,  H01R13/6469

CPC classification number: H01R13/6466 ,  H01F38/14 ,  H01F2038/146 ,  H01R4/2416 ,  H01R13/6469 ,  H01R13/665 ,  H01R24/62 ,  H01R2107/00 ,  H05K1/0228 ,  H05K1/0239 ,  H05K2201/10189

Abstract: A communication connector comprising plug interface contacts (25) having a plurality of conductor pairs, and corresponding cable connector contacts (28). A printed circuit board (26) connects the plug interface contacts (25) to respective cable connector contacts (28). The printed circuit board (26) includes circuitry between a first conductor pair and a second conductor pair. The circuitry has a first mutually inductive coupling between a first conductor of the first conductor pair and a first conductor of the second conductor pair, a first capacitive coupling between the first conductor of the first conductor pair and the first conductor of the second conductor pair. The first capacitive coupling is approximately concurrent with the first mutually inductive coupling. A shunt capacitive coupling connects the first conductor of the second conductor pair to a second conductor of the second conductor pair.

Abstract translation: 一种通信连接器，包括具有多个导体对的插头接口触头（25）和相应的电缆连接器触头（28）。 印刷电路板（26）将插头接口触点（25）连接到相应的电缆连接器触点（28）。 印刷电路板（26）包括在第一导体对和第二导体对之间的电路。 电路在第一导体对的第一导体和第二导体对的第一导体之间具有第一互感耦合，第一导体对的第一导体与第二导体对的第一导体之间的第一电容耦合。 第一电容耦合与第一互感耦合大致并发。 并联电容耦合将第二导体对的第一导体连接到第二导体对的第二导体。