公开(公告)号：WO2017180390A1

公开(公告)日：2017-10-19

申请号：PCT/US2017/026140

申请日：2017-04-05

Applicant: PANDUIT CORP.

Inventor： PATEL, Satish I. ,  CHURNOVIC, Roman J. ,  MUTANGANA, Jean de Dieu

IPC: H01R13/6461 ,  H01R13/6464 ,  H01R24/64 ,  H01R13/6466 ,  H01R13/6469 ,  H01R12/71

Abstract: Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.

Abstract translation: 本发明的实施例涉及可用于电缆连接的网络插座的设计。 在一个实施例中，本发明是一种RJ45插座，其利用两层PIC之间的薄介电膜，其通过其几何形状提供串扰补偿。 补偿是通过夹持薄介电膜的电容器板实现的。 这允许PIC层靠得很近并且在需要时实现更高的耦合，允许在靠近插头/插座接触点处发生更大量的补偿。 这可能会导致移动补偿更接近插头/插孔接触点，从而可能会减少进一步沿数据路径所需的补偿量。

公开(公告)号：EP4372918A2

公开(公告)日：2024-05-22

申请号：EP24159611.3

申请日：2017-04-05

Applicant: Panduit Corp.

Inventor： PATEL, Satish I ,  CHURNOVIC, Roman J ,  MUTANGANA, Jean de Dieu

IPC: H01R12/71

CPC classification number: H01R13/6461 ,  H01R13/6466 ,  H01R13/6469 ,  H01R24/64

Abstract: Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.

公开(公告)号：EP4372918A3

公开(公告)日：2024-06-19

申请号：EP24159611.3

申请日：2017-04-05

Applicant: Panduit Corp.

Inventor： PATEL, Satish I ,  CHURNOVIC, Roman J ,  MUTANGANA, Jean de Dieu

IPC: H01R13/6461 ,  H01R13/6464 ,  H01R24/64 ,  H01R13/6466 ,  H01R13/6469 ,  H01R12/71

CPC classification number: H01R13/6461 ,  H01R13/6466 ,  H01R13/6469 ,  H01R24/64

Abstract: Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.

公开(公告)号：EP3443621A1

公开(公告)日：2019-02-20

申请号：EP17717991.8

申请日：2017-04-05

Applicant: Panduit Corp.

Inventor： PATEL, Satish I. ,  CHURNOVIC, Roman J. ,  MUTANGANA, Jean de Dieu

IPC: H01R13/6461 ,  H01R13/6464 ,  H01R24/64 ,  H01R13/6466 ,  H01R13/6469 ,  H01R12/71