公开(公告)号：DE50014073D1

公开(公告)日：2007-04-05

申请号：DE50014073

申请日：2000-01-21

Applicant: PHILIPS INTELLECTUAL PROPERTY

Inventor： KLEE MAREIKE ,  LOEBL PETER ,  KIEWITT RAINER ,  VAN OPPEN PAUL ,  DERKSEN ROB J A ,  BRAND HANS-WOLFGANG

IPC: H01G4/12 ,  H03H1/00 ,  H01G17/00

Abstract: The construction comprises a substrate (1), a barrier layer (2), a resistance layer (3), a dielectric layer (4) with a dielectric constant (K) (7), an electrode (5), a second dielectric layer (6) and a second electrode (7). This sandwich assembly is enclosed by terminals (8) to form a suppression filter. A track (9) passes through the dielectric layers, connecting the resistance layer and the top dielectric layer