1.
    发明专利
    未知

    公开(公告)号:DE60304172T2

    公开(公告)日:2007-01-04

    申请号:DE60304172

    申请日:2003-05-13

    Abstract: A decoupling module for decoupling high-frequency signals from A power supply line, the module including a layer ( 30 ) of dielectric material which is arranged between a first and a second metallic layer ( 20, 22 ), where the first metallic layer ( 20 ) is connected as a ground electrode of the decoupling module and the second metallic layer ( 22 ) includes at least two surfaces of different size which are consecutively electrically connected between an input connection point and an output connection point, while two respective consecutive surfaces are connected to each other by only one conducting section.

    2.
    发明专利
    未知

    公开(公告)号:DE10233123A1

    公开(公告)日:2004-02-05

    申请号:DE10233123

    申请日:2002-07-20

    Abstract: A device for dynamic impedance matching between a power amplifier and an antenna, having a circulator ( 210 ), which routes a signal received from the power amplifier ( 10 ) at a first port via a second port to the antenna ( 30 ) and diverts the signal reflected at the antenna ( 30 ) and received at the second port through a third port; and a controllable matching network ( 24, 240, 250 ); is characterized in that a directional coupler ( 200 ) diverts a proportion of the signal traveling from the power amplifier ( 10 ) to the antenna ( 30 ), from which the magnitude and phase of the signal may be derived, to a signal detector ( 220 ); and the circulator ( 210 ) routes the entire signal reflected at the antenna ( 30 ) into the signal detector ( 220 ); wherein the signal detector ( 220 ) passes the magnitude and phase of both the signal traveling to the antenna ( 30 ) and the signal reflected at the antenna ( 30 ) to a controller ( 230 ), which evaluates the information received from the signal detector ( 220 ) in order to determine the present impedance value of the antenna ( 30 ) and to correct the controllable matching network ( 24, 240, 250 ) having active and passive components in accordance with the determined impedance value of the antenna ( 30 ).

    3.
    发明专利
    未知

    公开(公告)号:DE60304172D1

    公开(公告)日:2006-05-11

    申请号:DE60304172

    申请日:2003-05-13

    Abstract: A decoupling module for decoupling high-frequency signals from A power supply line, the module including a layer ( 30 ) of dielectric material which is arranged between a first and a second metallic layer ( 20, 22 ), where the first metallic layer ( 20 ) is connected as a ground electrode of the decoupling module and the second metallic layer ( 22 ) includes at least two surfaces of different size which are consecutively electrically connected between an input connection point and an output connection point, while two respective consecutive surfaces are connected to each other by only one conducting section.

    4.
    发明专利
    未知

    公开(公告)号:DE10255475A1

    公开(公告)日:2004-06-09

    申请号:DE10255475

    申请日:2002-11-28

    Abstract: A decoupling module for decoupling high-frequency signals from a voltage supply line, the module including a plurality of parallel-connected capacitors (K 1 , K 2 , . . . ), which each have a capacitance (C 1 , C 2 , . . . ), and are characterized in that at least one of the capacitors (K 1 ) has an inductance (L 1 ) which is selected dependent on the capacitance (C 1 ) of the capacitor (K 1 ) and the voltage supply line inductance (L 12 ), so that a resonance is generated which compensates the self-resonance of the system from at least a further capacitor (K 2 , . . . ) and the entire voltage supply line (S). L 12 is the inductance of the voltage supply line running between the parallel-connected capacitors.

    MULTILAYER STACK WITH COMPENSATED RESONANT CIRCUIT
    5.
    发明申请
    MULTILAYER STACK WITH COMPENSATED RESONANT CIRCUIT 审中-公开
    具有补偿谐振电路的多层堆叠

    公开(公告)号:WO2004084405A2

    公开(公告)日:2004-09-30

    申请号:PCT/IB2004000772

    申请日:2004-03-17

    CPC classification number: H03H7/175 H01F17/0006 H03H7/0115 H03H2001/0085

    Abstract: A metallization structure in a multilayer stack, which is arranged at a distance from a ground electrode, is characterized in that the metallization structure has a capacitor electrode and a line that acts as a coil, where the capacitor electrode and the line are arranged in a common plane which lies parallel with the ground electrode at a distance h1, and in that formula (I) where w is the width of the line.

    Abstract translation: 布置在与接地电极相距一定距离处的多层堆叠中的金属化结构的特征在于,金属化结构具有电容器电极和用作线圈的线,其中电容器电极和线被布置在 公共平面,其在距离h1处与接地电极平行,并且在公式(I)中,其中w是线的宽度。

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