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    Electroless metal deposition
    2.
    发明授权
    Electroless metal deposition 失效
    电镀金属沉积

    公开(公告)号：US3635758A

    公开(公告)日：1972-01-18

    申请号：US3635758D

    申请日：1969-08-04

    Applicant: PHOTOCIRCUITS CORP

    Inventor： SCHNEBLE FREDERICK W JR ,  MCCORMACK JOHN F ,  ZEBLISKY RUDOLPH J

    IPC: C23C18/40 ,  B44D1/18 ,  C23C3/02

    CPC classification number: C23C18/40

    Abstract: An improved method for enhancing the ductility of electroless metal deposits is provided in which an electroless metal bath contains an extraneous ion which has a preferential capacity for being coulombically adsorbed at the outer layer of an electric double layer present on an interface in contact with such bath on which said metal is electrolessly depositing, such ion being present in an amount sufficient to reduce the inclusion of hydrogen in the electrolessly deposited metal.

    Abstract translation: 提供了一种用于提高无电金属沉积物的延展性的改进方法，其中无电金属浴含有外来离子，该外来离子具有在与这种浴接触的界面上存在的电双层​​的外层上被库仑吸附的优先能力 所述金属在其上进行无电沉积，所述离子的存在量足以减少在无电沉积金属中包含氢。

    Electroless copper plating
    5.
    发明授权
    Electroless copper plating 失效

    公开(公告)号：US3485643A

    公开(公告)日：1969-12-23

    申请号：US3485643D

    申请日：1966-05-06

    Applicant: PHOTOCIRCUITS CORP

    Inventor： ZEBLISKY RUDOLPH J ,  SCHNEBLE FREDERICK W JR ,  MCCORMACK JOHN F

    IPC: C23C18/16 ,  C23C18/40 ,  C23C18/52 ,  C09D5/00

    CPC classification number: C23C18/405 ,  C23C18/48 ,  C23C18/52

    Abstract: 1,145,578. Printed circuits. PHOTOCIRCUITS CORP. 4 May, 1967 [6 May, 1966], No. 20684/67. Heading H1R. [Also in Division C7] Portions of an insulating substrate, such as a plastics material, of which many suitable examples are listed, are sensitized in the form of a desired printed circuit form, e.g. by treatment with an acidic aqueous solution of stannous chloride followed by a dilute acid aqueous solution of Pd chloride, or by treatment with a single acidic solution containing stannous chloride and a precious metal chloride such as Pd chloride. Cu or other metal is then deposited on one or more surfaces of the substrate, and on the walls of holes through it, by electroless deposition from a solution on to the sensitized parts of the substrate, said solution including a compound containing a cyanide radical complexed with a metal from Group VIII of the Periodic Table.

    Electroless copper deposition
    6.
    发明授权
    Electroless copper deposition 失效
    电镀铜沉积

    公开(公告)号：US3615737A

    公开(公告)日：1971-10-26

    申请号：US3615737D

    申请日：1969-08-04

    Applicant: PHOTOCIRCUITS CORP

    Inventor： SCHNEBLE FREDERICK W JR ,  MCCORMACK JOHN F ,  ZEBLISKY RUDOLPH J ,  WILLIAMSON JOHN D

    IPC: C23C18/40 ,  C23C3/02

    CPC classification number: C23C18/40

    Abstract: An improved electroless metal deposition solution is provided which comprises, in combination: an ion of a metal whose electroless metal deposition is desired; a complexing agent for said ion; a reducing agent for said ion; a pH regulator; and a small effective amount of an extraneous ion which has a potential dependent capacity for inner double layer absorption at a surface in contact with the solution on which said metal is electrolessly depositing. In addition, improved methods for electrolessly depositing metal, as well as enhancing the ductility of electroless metal deposits are provided.

    Autocatalytic gold plating solutions
    7.
    发明授权
    Autocatalytic gold plating solutions 失效
    自动镀金解决方案

    公开(公告)号：US3589916A

    公开(公告)日：1971-06-29

    申请号：US3589916D

    申请日：1969-11-14

    Applicant: PHOTOCIRCUITS CORP

    Inventor： MCCORMACK JOHN F

    IPC: C23C18/40 ,  C23C18/44 ,  C23C3/02

    CPC classification number: C23C18/40 ,  C23C18/44

    Abstract: IMPROVED ELECTROLESS GOLD PLATING BATHS ARE PROVIDED BY FORMULATING IN AQUEOUS ALKALINE MEDIA, A WATER SOLUBLE GOLD SALT; A COMPLEXING AGENT FOR GOLD, A WATER SOLUBLE BOROHYDRIDE OR AMINE BORANE REDUCING AGENT FOR GOLD, AND A SMALL EFFECTIVE STABILIZING AMOUNT OF A CYANIDE COMPOUND IN AN AMOUNT OF BETWEEN ABOUT 5 MICROGRAMS AND 500 MILLIGRAMS.

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