公开(公告)号：DE1696604A1

公开(公告)日：1972-02-03

申请号：DEP0043757

申请日：1968-01-04

Applicant: PHOTOCIRCUITS CORP

Inventor： WILLIAM SCHNEBLE FREDERICK ,  LEECH EDWARD ,  POLICHETTEN JOSEPH

IPC: B01J37/00 ,  C23C18/16 ,  C23C18/20 ,  C23C18/30 ,  C23C18/31 ,  C23C18/34 ,  C23C18/40 ,  C23C18/44 ,  D06Q1/04 ,  H01B3/30 ,  H05K1/03 ,  H05K3/10 ,  H05K3/18 ,  H05K3/42 ,  H05K3/46 ,  C23C3/00

Abstract: Improvements in the metallization of insulating substrates, characterized by using a filler or catalytic filler formed by inert solid particles, finely divided, with a deposit above comprising, in combination, a cationic wetting agent characterized by a hydrophobic group that becomes a part of the cation when the wetting agent is dissolved in water, and a metal belonging to groups 1b and 8 of the periodic table of the elements, including mixtures of such metals, establishing that in said composition the inert solid particles are kaolin, metal is in elemental form and the cationic wetting agent contains nitrogen and phosphorus. (Machine-translation by Google Translate, not legally binding)