公开(公告)号：US20130330850A1

公开(公告)日：2013-12-12

申请号：US13922180

申请日：2013-06-19

Applicant: PLASTIC LOGIC LIMITED

Inventor： Michael Banach ,  Thomas Meredith Brown ,  Carl Hayton

IPC: H01L51/00

CPC classification number: H01L51/0023 ,  H01L51/0037 ,  H01L51/052 ,  H01L51/0541 ,  H01L51/055

Abstract: A method is provided to isolated conductive pads on top of a multi-layer polymer device structure. The method utilizes laser radiation to ablate conductive material and create a non-conductive path, electrically isolating the conductive pads. The process is self-limiting and incorporates at least one layer within the stack that absorbs the radiation at the required wavelength. The prevention of radiation degradation of the underlying layers is achieved, as absorption of radiation occurs primarily on the surface of the structure, but not in any of the radiation sensitive underlying layers of the electronic device. The method preferably uses low energy infrared radiation which has been shown to produce little debris and no device degradation.

Abstract translation: 在多层聚合物器件结构的顶部提供隔离导电焊盘的方法。 该方法利用激光辐射来消融导电材料并产生非导电路径，电绝缘导电焊盘。 该过程是自限制的，并且在堆叠内并入吸收所需波长的辐射的至少一层。 实现了防止下层的辐射降解，因为辐射的吸收主要发生在结构的表面上，而不是在电子器件的任何辐射敏感的下层中。 该方法优选使用低能量红外辐射，其已经显示产生很少的碎片，并且没有器件劣化。

公开(公告)号：US08684779B2

公开(公告)日：2014-04-01

申请号：US13922180

申请日：2013-06-19

Applicant: Plastic Logic Limited

Inventor： Michael Banach ,  Thomas Meredith Brown ,  Carl Hayton

IPC: H01J9/00

CPC classification number: H01L51/0023 ,  H01L51/0037 ,  H01L51/052 ,  H01L51/0541 ,  H01L51/055

Abstract: A method is provided to isolated conductive pads on top of a multi-layer polymer device structure. The method utilizes laser radiation to ablate conductive material and create a non-conductive path, electrically isolating the conductive pads. The process is self-limiting and incorporates at least one layer within the stack that absorbs the radiation at the required wavelength. The prevention of radiation degradation of the underlying layers is achieved, as absorption of radiation occurs primarily on the surface of the structure, but not in any of the radiation sensitive underlying layers of the electronic device. The method preferably uses low energy infrared radiation which has been shown to produce little debris and no device degradation.

Abstract translation: 在多层聚合物器件结构的顶部提供隔离导电焊盘的方法。 该方法利用激光辐射来消融导电材料并产生非导电路径，电绝缘导电焊盘。 该过程是自限制的，并且在堆叠内并入吸收所需波长的辐射的至少一层。 实现了防止下层的辐射降解，因为辐射的吸收主要发生在结构的表面上，而不是在电子器件的任何辐射敏感的下层中。 该方法优选使用低能量红外辐射，其已经显示产生很少的碎片，并且没有器件劣化。