公开(公告)号：USRE45885E1

公开(公告)日：2016-02-09

申请号：US14260240

申请日：2014-04-23

Applicant: Plastic Logic Limited

Inventor： Paul A. Cain ,  Carl Hayton

IPC: H01L21/00 ,  H01L21/461 ,  H01L51/00 ,  B23K26/06 ,  B23K26/40 ,  H05K3/02 ,  H01L21/268 ,  H01L21/768 ,  H05K3/46

CPC classification number: H01L51/0023 ,  B23K26/063 ,  B23K26/4075 ,  B23K2101/40 ,  B23K2103/16 ,  H01L21/268 ,  H01L21/76838 ,  H05K3/027 ,  H05K3/4644 ,  H05K2201/09672

Abstract: A method of fabricating an electronic device, the device including a plurality of layers on a substrate, the layers including an upper conductive layer and at least one patterned underlying layer between said conductive layer and said substrate. The method includes patterning said underlying layer, and patterning said upper conductive layer by laser ablation using a stepwise process in which successive areas of said upper conductive layer are ablated by successively applied laser patterns. The successively applied laser patterns overlap one another in an overlap region. The method further includes configuring a said laser pattern and said patterned underlying layer with respect to one another such that in a said overlap region said patterned underlying layer is substantially undamaged by said stepwise laser ablation.

Abstract translation: 一种制造电子器件的方法，所述器件在衬底上包括多个层，所述层包括上导电层和在所述导电层和所述衬底之间的至少一个图案化底层。 该方法包括图案化所述下层，以及通过使用逐步过程的激光烧蚀来图案化所述上导电层，其中所述上导电层的连续区域被依次施加的激光图案消融。 连续施加的激光图案在重叠区域中彼此重叠。 该方法还包括相对于彼此配置所述激光图案和所述图案化的下层，使得在所述重叠区域中，所述图案化下层通过所述逐步激光烧蚀基本上未损坏。

公开(公告)号：US20130330850A1

公开(公告)日：2013-12-12

申请号：US13922180

申请日：2013-06-19

Applicant: PLASTIC LOGIC LIMITED

Inventor： Michael Banach ,  Thomas Meredith Brown ,  Carl Hayton

IPC: H01L51/00

CPC classification number: H01L51/0023 ,  H01L51/0037 ,  H01L51/052 ,  H01L51/0541 ,  H01L51/055

Abstract: A method is provided to isolated conductive pads on top of a multi-layer polymer device structure. The method utilizes laser radiation to ablate conductive material and create a non-conductive path, electrically isolating the conductive pads. The process is self-limiting and incorporates at least one layer within the stack that absorbs the radiation at the required wavelength. The prevention of radiation degradation of the underlying layers is achieved, as absorption of radiation occurs primarily on the surface of the structure, but not in any of the radiation sensitive underlying layers of the electronic device. The method preferably uses low energy infrared radiation which has been shown to produce little debris and no device degradation.

Abstract translation: 在多层聚合物器件结构的顶部提供隔离导电焊盘的方法。 该方法利用激光辐射来消融导电材料并产生非导电路径，电绝缘导电焊盘。 该过程是自限制的，并且在堆叠内并入吸收所需波长的辐射的至少一层。 实现了防止下层的辐射降解，因为辐射的吸收主要发生在结构的表面上，而不是在电子器件的任何辐射敏感的下层中。 该方法优选使用低能量红外辐射，其已经显示产生很少的碎片，并且没有器件劣化。

公开(公告)号：US08684779B2

公开(公告)日：2014-04-01

申请号：US13922180

申请日：2013-06-19

Applicant: Plastic Logic Limited

Inventor： Michael Banach ,  Thomas Meredith Brown ,  Carl Hayton

IPC: H01J9/00

CPC classification number: H01L51/0023 ,  H01L51/0037 ,  H01L51/052 ,  H01L51/0541 ,  H01L51/055

Abstract: A method is provided to isolated conductive pads on top of a multi-layer polymer device structure. The method utilizes laser radiation to ablate conductive material and create a non-conductive path, electrically isolating the conductive pads. The process is self-limiting and incorporates at least one layer within the stack that absorbs the radiation at the required wavelength. The prevention of radiation degradation of the underlying layers is achieved, as absorption of radiation occurs primarily on the surface of the structure, but not in any of the radiation sensitive underlying layers of the electronic device. The method preferably uses low energy infrared radiation which has been shown to produce little debris and no device degradation.

Abstract translation: 在多层聚合物器件结构的顶部提供隔离导电焊盘的方法。 该方法利用激光辐射来消融导电材料并产生非导电路径，电绝缘导电焊盘。 该过程是自限制的，并且在堆叠内并入吸收所需波长的辐射的至少一层。 实现了防止下层的辐射降解，因为辐射的吸收主要发生在结构的表面上，而不是在电子器件的任何辐射敏感的下层中。 该方法优选使用低能量红外辐射，其已经显示产生很少的碎片，并且没有器件劣化。