公开(公告)号：US20130222686A1

公开(公告)日：2013-08-29

申请号：US13748940

申请日：2013-01-24

Applicant: Pantech Co., Ltd.

Inventor： Sun Woo BAEK

IPC: H04N5/225 ,  H05K3/34

CPC classification number: H04N5/2251 ,  H04N5/2257 ,  H05K1/182 ,  H05K3/325 ,  H05K3/341 ,  H05K2201/10121 ,  H05K2201/10856 ,  Y10T29/4913

Abstract: A terminal includes a first board including an accommodation portion, the accommodation portion being disposed in a first groove of the first board, and a camera module mounted in the accommodation portion. A method for manufacturing a terminal includes obtaining a first board including an accommodation portion, the accommodation portion being disposed in a first groove of the first board, obtaining a camera module to be mounted in the accommodation portion, and mounting the camera module in the accommodation portion.

Abstract translation: 端子包括：第一板，包括容纳部分，所述容纳部分设置在所述第一板的第一凹槽中;以及相机模块，安装在所述容纳部分中。 一种端子的制造方法，其特征在于，获得包括容纳部的第一基板，所述容纳部配置在所述第一基板的第一槽内，获得安装在所述容纳部的相机模块，将所述相机模块安装在所述容纳部 一部分。