RING-SHAPED LIGHT GUIDE MODULE AND LIGHT EMITTING DEVICE

    公开(公告)号:US20240402409A1

    公开(公告)日:2024-12-05

    申请号:US18217321

    申请日:2023-06-30

    Abstract: The present disclosure provides a ring-shaped light guide module, which includes a ring-shaped light guide plate, a circuit board, a plurality of top light-emitting elements and a reflective layer. The ring-shaped light guide plate has a plurality of accommodating recesses disposed on an outer ring surface of the ring-shaped light guide plate and separated from each other. The circuit board surrounds a portion of the outer ring surface of the ring-shaped light guide plate. The top light-emitting elements are disposed on the circuit board and respectively located in the accommodating recesses. The reflective layer covers a portion of an inner ring surface and a first side surface of the ring-shaped light guide plate. A light emitting device including the aforementioned ring-shaped light guide module is also provided.

    Backlight kit
    2.
    发明授权

    公开(公告)号:US11754769B1

    公开(公告)日:2023-09-12

    申请号:US18125284

    申请日:2023-03-23

    CPC classification number: G02B6/0046 G02B6/0043 G02B6/0051 G02B6/0088

    Abstract: A backlight kit includes a base member, a covering member, a slim-type light guide element and an illumination module. The covering member is combined with the base member. The slim-type light guide element and the illumination module are arranged between the base member and the covering member. After the illumination module emits a light beam to the slim-type light guide element, the light beam is transferred through the slim-type light guide element. Consequently, a luminance gradient region is formed on the surface of the covering member.

    Light guide module including thick portion and thin portion

    公开(公告)号:US11927788B1

    公开(公告)日:2024-03-12

    申请号:US18132217

    申请日:2023-04-07

    Abstract: A light guide module is provided, which includes a circuit board, one or more light-emitting elements, a light guide plate, a first reflective layer and a second reflective layer. The one or more light-emitting elements are disposed on the circuit board. The light guide plate is located on the circuit board, in which the light guide plate has a thick portion and a thin portion connected to the thick portion, and the thin portion is located over the one or more light-emitting elements, and a side surface of the thick portion adjacent to the thin portion is laterally adjacent to the one or more light-emitting elements. The first reflective layer covers a side surface of the thick portion away from the thin portion. The second reflective layer covers an upper surface of the thick portion and an upper surface of the thin portion.

    Miniature backlight kit
    4.
    发明授权

    公开(公告)号:US11746968B1

    公开(公告)日:2023-09-05

    申请号:US18122568

    申请日:2023-03-16

    CPC classification number: F21S4/28 F21V13/04 F21V17/06 F21V2200/20

    Abstract: A miniature backlight kit includes a covering member, a light-shading element, a light guide element, a housing and a light-emitting unit. The light-emitting unit is disposed within a first concave structure of the light-shading element. The light-shading element is disposed within a second concave structure of the light guide element. The light guide element is covered by the lateral wall of the housing. The light-emitting unit emits a light beam. The light beam is reflected to the lateral wall of the housing by the light guide element. Consequently, a luminance gradient region is formed on the surface of the lateral wall of the housing.

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