公开(公告)号：US11746968B1

公开(公告)日：2023-09-05

申请号：US18122568

申请日：2023-03-16

Applicant: Primax Electronics Ltd.

Inventor： Wei-Ping Chan ,  Ruey-Piin Wang ,  Chia-Ming Li ,  Yin-Liang Hu ,  Ming-Han Yu

IPC: F21S4/28 ,  F21V17/06 ,  F21V13/04

CPC classification number: F21S4/28 ,  F21V13/04 ,  F21V17/06 ,  F21V2200/20

Abstract: A miniature backlight kit includes a covering member, a light-shading element, a light guide element, a housing and a light-emitting unit. The light-emitting unit is disposed within a first concave structure of the light-shading element. The light-shading element is disposed within a second concave structure of the light guide element. The light guide element is covered by the lateral wall of the housing. The light-emitting unit emits a light beam. The light beam is reflected to the lateral wall of the housing by the light guide element. Consequently, a luminance gradient region is formed on the surface of the lateral wall of the housing.

公开(公告)号：US20240402409A1

公开(公告)日：2024-12-05

申请号：US18217321

申请日：2023-06-30

Applicant: Primax Electronics Ltd.

Inventor： Ming-Hui Yeh ,  Ruey-Piin Wang ,  Yin-Liang Hu ,  Chia-Ming Li ,  Ming-Han Yu ,  Wei-Ping Chan

IPC: F21V8/00

Abstract: The present disclosure provides a ring-shaped light guide module, which includes a ring-shaped light guide plate, a circuit board, a plurality of top light-emitting elements and a reflective layer. The ring-shaped light guide plate has a plurality of accommodating recesses disposed on an outer ring surface of the ring-shaped light guide plate and separated from each other. The circuit board surrounds a portion of the outer ring surface of the ring-shaped light guide plate. The top light-emitting elements are disposed on the circuit board and respectively located in the accommodating recesses. The reflective layer covers a portion of an inner ring surface and a first side surface of the ring-shaped light guide plate. A light emitting device including the aforementioned ring-shaped light guide module is also provided.

公开(公告)号：US11754769B1

公开(公告)日：2023-09-12

申请号：US18125284

申请日：2023-03-23

Applicant: Primax Electronics Ltd.

Inventor： Wei-Ping Chan ,  Ruey-Piin Wang ,  Chia-Ming Li ,  Hung-Wei Kuo

IPC: F21V8/00

CPC classification number: G02B6/0046 ,  G02B6/0043 ,  G02B6/0051 ,  G02B6/0088

Abstract: A backlight kit includes a base member, a covering member, a slim-type light guide element and an illumination module. The covering member is combined with the base member. The slim-type light guide element and the illumination module are arranged between the base member and the covering member. After the illumination module emits a light beam to the slim-type light guide element, the light beam is transferred through the slim-type light guide element. Consequently, a luminance gradient region is formed on the surface of the covering member.