公开(公告)号：WO2014137749A1

公开(公告)日：2014-09-12

申请号：PCT/US2014/019067

申请日：2014-02-27

Applicant: QUALCOM INCORPORATED

Inventor： CARTER, Mark Anthony ,  ZHANG, Yang ,  PENG Yongsheng ,  STEENSTRA, Jack Brian ,  BARRETT, Michael Gerard

IPC: H05K1/18 ,  H05K3/46 ,  H01L25/00 ,  H01L23/31 ,  H01L23/373 ,  H05K1/02 ,  H05K3/00 ,  H05K3/28 ,  H05K1/14

CPC classification number: H05K7/205 ,  H01L23/3121 ,  H01L23/3677 ,  H01L23/5389 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/0218 ,  H05K1/141 ,  H05K1/185 ,  H05K3/0097 ,  H05K3/284 ,  H05K3/30 ,  H05K3/4608 ,  H05K9/00 ,  H05K2201/068 ,  H05K2201/09872 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Method and apparatuses for making a smart phone on a chip (SPOC) are described. Active components (210) are embedded into a copper core (212). In an aspect, and optionally, passive components may also be embedded into the copper core. Printed circuit board (PCB) laminate (224, 225) is layered above and below the copper core. A copper ground plane (214) is fixed underneath the layer of PCB laminate (225) below, and furthest from, the copper core. One or more additional components (218, 220) are surface mounted on top of the PCB laminate layers (224) above the copper core. A conformal coating is applied to completely and thinly encase the one or more surface mounted additional components. The conformal coating includes trenching and a copper sputter coating finish.

Abstract translation: 描述用于制造芯片上的智能手机（SPOC）的方法和装置。 活性组分（210）嵌入铜芯（212）中。 在一方面，并​​且可选地，无源部件也可以嵌入到铜芯中。 印刷电路板（PCB）层压板（224,225）层叠在铜芯的上方和下方。 铜接地平面（214）固定在PCB层压板（225）的下方，最远离铜芯的下方。 一个或多个附加部件（218,220）被表面安装在铜芯上方的PCB层叠层（224）的顶部上。 施加保形涂层以完全和薄地包住一个或多个表面安装的附加部件。 保形涂层包括开沟和铜溅射涂层。