公开(公告)号：HK1070228A1

公开(公告)日：2005-06-10

申请号：HK05102746

申请日：2005-04-01

Applicant: QUALCOMM INC

Inventor： SINNARAJAH RAGULAN ,  TIEDEMANN EDWARD G JR ,  REZAIIFAR RAMIN ,  WANG JUN J ,  HO DUNCAN D

IPC: H04J13/00 ,  H04L20090101 ,  H04L1/16 ,  H04L1/18 ,  H04L12/28 ,  H04L12/56 ,  H04L29/06 ,  H04W28/04 ,  H04W28/06 ,  H04W28/18 ,  H04W72/04 ,  H04W76/02

Abstract: Techniques for minimizing call setup latency are disclosed. In one aspect, multiple signaling messages are encapsulated and sent as a single message thus reducing the total delay incurred by sequential transmission. In one embodiment, an encapsulation message includes a field indicating the number of messages encapsulated therein. In one example, the encapsulation is performed at a Link Access Control (LAC) layer. Alternate embodiments may perform encapsulation at an alternate layer.