公开(公告)号：HK1070228A1

公开(公告)日：2005-06-10

申请号：HK05102746

申请日：2005-04-01

Applicant: QUALCOMM INC

Inventor： SINNARAJAH RAGULAN ,  TIEDEMANN EDWARD G JR ,  REZAIIFAR RAMIN ,  WANG JUN J ,  HO DUNCAN D

IPC: H04J13/00 ,  H04L20090101 ,  H04L1/16 ,  H04L1/18 ,  H04L12/28 ,  H04L12/56 ,  H04L29/06 ,  H04W28/04 ,  H04W28/06 ,  H04W28/18 ,  H04W72/04 ,  H04W76/02

Abstract: Techniques for minimizing call setup latency are disclosed. In one aspect, multiple signaling messages are encapsulated and sent as a single message thus reducing the total delay incurred by sequential transmission. In one embodiment, an encapsulation message includes a field indicating the number of messages encapsulated therein. In one example, the encapsulation is performed at a Link Access Control (LAC) layer. Alternate embodiments may perform encapsulation at an alternate layer.

公开(公告)号：HK1097679A1

公开(公告)日：2007-06-29

申请号：HK07103135

申请日：2007-03-23

Applicant: QUALCOMM INC

Inventor： SINNARAJAH RAGULAN ,  WANG JUN J ,  ATHALYE SANJEEV ARVIND

IPC: H04W28/12 ,  H04B7/216 ,  H04L12/18 ,  H04W20090101 ,  H04W4/06 ,  H04W68/00

Abstract: A method and a system for providing signaling in cellular telephone system providing broadcast services to fully integrate broadcast services with the services provided by the cellular telephone systems. The signaling method coordinate interaction between an access network and the subscriber station to allowing the subscriber station to decode the broadcast service, to receive paging messages while receiving the broadcast service, to properly transition between operation states, and other functions known to one of ordinary skill in the art.

公开(公告)号：HK1083287A1

公开(公告)日：2006-06-30

申请号：HK06103240

申请日：2006-03-14

Applicant: QUALCOMM INC

Inventor： SINNARAJAH RAGULAN ,  WANG JUN J ,  LEUNG NIKOLAI K ,  CHEN TAO

IPC: H04M3/42 ,  H04B7/26 ,  H04L12/28 ,  H04L12/56 ,  H04W4/06

公开(公告)号：HK1070503A1

公开(公告)日：2005-06-17

申请号：HK05102993

申请日：2005-04-08

Applicant: QUALCOMM INC

Inventor： SINNARAJAH RAGULAN ,  WANG JUN J ,  BENDER PAUL E ,  CHEN TAO T ,  TIEDEMANN EDWARD G JR

IPC: H04B7/24 ,  H04H20/28 ,  H04H20/72 ,  H04H40/27 ,  H04H60/91 ,  H04L20060101 ,  H04L12/18 ,  H04L12/56 ,  H04L12/58 ,  H04W4/06 ,  H04W48/12 ,  H04W60/02 ,  H04W68/00 ,  H04W84/04

公开(公告)号：HK1067489A1

公开(公告)日：2005-04-08

申请号：HK04110245

申请日：2004-12-24

Applicant: QUALCOMM INC

Inventor： HO SAI YIU DUNCAN ,  TIEDEMANN EDWARD G JR ,  WANG JUN J ,  SINNARAJAH RAGULAN ,  REZAIIFAR RAMIN

IPC: H04J13/00 ,  H04M3/00 ,  H04W8/22 ,  H04W8/24 ,  H04W76/02