公开(公告)号：SG11202007285UA

公开(公告)日：2020-08-28

申请号：SG11202007285U

申请日：2019-02-04

Applicant: QUALCOMM INC

Inventor： ZHANG SHU ,  KIM DANIEL DAEIK ,  GAN CHENQIAN ,  KOO BONHOON ,  NEJATI BABAK

IPC: H01F17/02 ,  H01F17/00 ,  H01L23/52

Abstract: Some features pertain to a substrate, and a first inductor integrated into the substrate. The first inductor includes a plurality of first inductor windings in a first metal layer and a second metal layer. A second inductor is integrated into the substrate. The second inductor includes a first spiral in a third metal layer. The first spiral is located at least partially inside the plurality of first inductor windings, wherein the second inductor is perpendicular to the first inductor.

公开(公告)号：SG11202004020TA

公开(公告)日：2020-07-29

申请号：SG11202004020T

申请日：2018-12-10

Applicant: QUALCOMM INC

Inventor： KIM DANIEL DAEIK ,  KOO BONHOON ,  NEJATI BABAK

IPC: H01F17/00 ,  H01F41/04

Abstract: A vertical inductor structure includes a first laminate substrate forming a first portion of the vertical inductor structure and a second laminate substrate forming a second portion. Each laminate substrate includes a plurality of first traces embedded in a layer of the laminate substrate, a plurality of first vertical columns, and a plurality of second vertical columns. Each first vertical columns is coupled to a first end of a respective first trace, and each second vertical column is coupled to a second end of a respective first trace. The second laminate substrate is mounted on the first laminate substrate such that each first vertical column of the first laminate substrate is coupled to a respective first vertical column of the second laminate substrate, and each second vertical column of the first laminate substrate is coupled to a respective second vertical column of the second laminate substrate.