公开(公告)号：SG11201705672XA

公开(公告)日：2017-09-28

申请号：SG11201705672X

申请日：2016-02-18

Applicant: QUALCOMM INC

Inventor： FU JIE ,  KIM CHIN-KWAN ,  ALDRETE MANUEL ,  SHAH MILIND PRAVIN ,  SHIRLEY DWAYNE RICHARD

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/538 ,  H01L25/10

Abstract: An integrated circuit package includes a substrate/interposer assembly having a plurality of conductive contacts and a plurality of conductive posts, such as copper posts, electrically coupled to at least some of the conductive contacts in the substrate/interposer assembly. The conductive posts are surrounded by a protective dielectric, such as a photoimageable dielectric (PID). An integrated circuit die may be disposed on the substrate/interposer assembly within an interior space surrounded by the dielectric. An additional integrated circuit die may be provided in a package-on-package (POP) configuration.

公开(公告)号：SG11201705247YA

公开(公告)日：2017-09-28

申请号：SG11201705247Y

申请日：2016-01-26

Applicant: QUALCOMM INC

Inventor： SYED AHMER RAZA ,  KIM CHIN-KWAN ,  BCHIR OMAR JAMES ,  SHAH MILIND PRAVIN ,  LANE RYAN DAVID

IPC: H01L25/065 ,  H01L21/98 ,  H01L23/13 ,  H01L23/538

Abstract: A semiconductor package for a side by side die configuration may include a substrate having a cavity, a bridge interposer positioned within the cavity and having an active side facing active sides of a first die and a second die and partially horizontally overlapping the first die and the second die to provide an interconnection between the first die and the second die, and a thermal element attached to backsides of the first die and the second die to provide a heat path and heat storage for the first die and the second die.