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公开(公告)号：RU2283537C2
公开(公告)日：2006-09-10
申请号：RU2004111661
申请日：2002-09-19
Applicant: QUALCOMM INC
Inventor： RAO SUBRAMANIA P , VENKATESAN SIVARAMA , GO GVANG-KHIUN , AGRAVAL AVNISH , TERASAVA DAJSUKE
IPC: H04B1/7073 , H04B1/7075 , H04B1/7077 , H04B1/7083 , H04B1/709 , H04B1/7093 , H04Q7/38
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