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公开(公告)号:SI2858408T1
公开(公告)日:2019-08-30
申请号:SI200632334
申请日:2006-12-20
Applicant: QUALCOMM INC
Inventor: DAS ARNAB , ALEJANDRO ANIGSTEIN PABLO , LI JUNYI , VENKATA UPPALA SATHYADEV , LAROIA RAJIV , RANGAN SUNDEEP
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公开(公告)号:HUE025368T2
公开(公告)日:2016-02-29
申请号:HUE06845871
申请日:2006-12-20
Applicant: QUALCOMM INC
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公开(公告)号:HK1205617A1
公开(公告)日:2015-12-18
申请号:HK15106136
申请日:2009-02-27
Applicant: QUALCOMM INC
Inventor: DAS ARNAB , ALEJANDRO ANIGSTEIN PABLO , LI JUNYI , VENKATA UPPALA SATHYADEV , LAROIA RAJIV , RANGAN SUNDEEP
IPC: H04W20090101
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4.
公开(公告)号:PL1969889T3
公开(公告)日:2013-09-30
申请号:PL06845855
申请日:2006-12-20
Applicant: QUALCOMM INC
Inventor: PARIZHSKY VLADIMIR , LAROIA RAJIV , LI JUNYI , VENKATA UPPALA SATHYADEV , DAS ARNAB
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5.
公开(公告)号:PL2129185T3
公开(公告)日:2012-07-31
申请号:PL09168938
申请日:2006-12-20
Applicant: QUALCOMM INC
Inventor: PARIZHSKY VLADIMIR , LAROIA RAJIV , LI JUNYI , VENKATA UPPALA SATHYADEV , DAS ARNAB
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公开(公告)号:DK2129186T3
公开(公告)日:2012-04-10
申请号:DK09168951
申请日:2006-12-20
Applicant: QUALCOMM INC
Inventor: PARIZHSKY VLADIMIR , LAROIA RAJIV , LI JUNYI , VENKATA UPPALA SATHYADEV , DAS ARNAB
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7.
公开(公告)号:DK2858408T3
公开(公告)日:2019-08-12
申请号:DK14194480
申请日:2006-12-20
Applicant: QUALCOMM INC
Inventor: DAS ARNAB , ALEJANDRO ANIGSTEIN PABLO , LI JUNYI , VENKATA UPPALA SATHYADEV , LAROIA RAJIV , RANGAN SUNDEEP
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公开(公告)号:HUE035321T2
公开(公告)日:2018-05-02
申请号:HUE06847884
申请日:2006-12-20
Applicant: QUALCOMM INC
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公开(公告)号:PL1964418T3
公开(公告)日:2015-10-30
申请号:PL06845871
申请日:2006-12-20
Applicant: QUALCOMM INC
Inventor: DAS ARNAB , RANGAN SUNDEEP , ALEJANDRO ANIGSTEIN PABLO , LI JUNYI , VENKATA UPPALA SATHYADEV , LAROIA RAJIV
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10.
公开(公告)号:DK2129185T3
公开(公告)日:2012-05-14
申请号:DK09168938
申请日:2006-12-20
Applicant: QUALCOMM INC
Inventor: PARIZHSKY VLADIMIR , LAROIA RAJIV , LI JUNYI , VENKATA UPPALA SATHYADEV , DAS ARNAB
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