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    SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF A WEARABLE COMPUTING DEVICE BASED ON PROXIMITY TO A USER
    1.
    发明专利
    SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF A WEARABLE COMPUTING DEVICE BASED ON PROXIMITY TO A USER 未知

    公开(公告)号：SG11201905680QA

    公开(公告)日：2019-08-27

    申请号：SG11201905680Q

    申请日：2018-02-01

    Applicant: QUALCOMM INC

    Inventor： SAHU VIVEK ,  LE DON ,  ANDERSON JON ,  WANG PENG ,  WANG SHUJUAN

    IPC: G06F1/32 ,  G06F1/20 ,  H04M1/725 ,  H04W52/02

    Abstract: STARTPROXIMITY DETERMINATION SUBROUTINE IDENTIFY AND MONITOR AVAILABLE SENSORS IN WCD 710 CATEGORIZE AVAILABLE SENSORS INTO PRE-RANKED CATEGORIES AND ASSIGN PRIORITY LEVELS TO SENSORS IN EACH CATEGORY DETERMINE READING(S) FROM OTHER SENSOR(S) IN CATEGORY / 71 W O 20 18/ 144767 Al FOR HIGHEST RANKING CATEGORY WITH AN AVAILABLE SENSOR. DETERMINE READING FROM AVAILABLE SENSOR IN CATEGORY WITH HIGHEST PRIORITY LEVEL DETERMINE USER PROXIMITY STATE BASED ON SENSOR READ NG(S) (RETURN) FIG. 7 (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 09 August 2018 (09.08.2018) WIP0 I PCT o mono VIII °nolo Ho Ho Ho IID 100 Imo oimIE (10) International Publication Number WO 2018/144767 Al (51) International Patent Classification: GOOF 1/20 (2006.01) HO4M 1/725 (2006.01) GOOF 1/32 (2006.01) H04W 52/02 (2009.01) (21) International Application Number: PCT/US2018/016501 (22) International Filing Date: 01 February 2018 (01.02.2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 15/424,661 03 February 2017 (03.02.2017) US (71) Applicant: QUALCOMM INCORPORATED [US/US]; ATTN: International IP Administration, 5775 Morehouse Drive, San Diego, California 92121-1714 (US). (72) Inventors: SAHU, Vivek; 5775 Morehouse Drive, San Diego, California 92121 (US). LE, Don; 5775 Morehouse Drive, San Diego, California 92121 (US). ANDERSON, Jon; 5775 Morehouse Drive, San Diego, California 92121 (US). WANG, Peng; 5775 Morehouse Drive, San Diego, California 92121 (US). WANG, Shujuan; 5775 Morehouse Drive, San Diego, California 92121 (US). (74) Agent: WIGMORE, Steven P. et al.; 50 Glenlake Park- way, Suite 340, Atlanta, Georgia 30328 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). (54) Title: SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF A WEARABLE COMPUTING DEVICE BASED ON = PROXIMITY TO A USER (57) : Because the touch temperature of a wearable computing device (\"WCD\") may be an insignificant factor for user experience when the WCD is not being worn by a user, embodiments of the solution seek to modify thermal management policies based on an inferred user proximity state. Exemplary embodiments monitor one or more signals from readily available sensors in the WCD that have primary purposes other than mea- suring user proximity. Depending on embodiment, the sensors may be se- lected from a group consisting of a heart rate monitor, a pulse monitor, an 02 sensor, a bio-impedance sensor, a gyroscope, an accelerometer, a tem- perature sensor, a pressure sensor, a capacitive sensor, a resistive sensor and a light sensor. Using the signals generated by such sensors, relative physical proximity of the WCD to a user may be inferred and, based on the user proximity state, thermal policies either relaxed or tightened. [Continued on next page] WO 2018/144767 Al OII Declarations under Rule 4.17: as to applicant's entitlement to apply for and be granted a patent (Rule 4.17(H)) as to the applicant's entitlement to claim the priority of the earlier application (Rule 4.17(iii)) Published: — with international search report (Art. 21(3))

    SYSTEMS, METHODS, AND APPARATUS FOR PASSIVE COOLING OF UAVS
    3.
    发明专利
    SYSTEMS, METHODS, AND APPARATUS FOR PASSIVE COOLING OF UAVS 未知

    公开(公告)号：CA3043042A1

    公开(公告)日：2018-06-28

    申请号：CA3043042

    申请日：2017-12-01

    Applicant: QUALCOMM INC

    Inventor： WANG PENG ,  LE DON ,  ANDERSON JON ,  CHIU CHINCHUAN ANDREW

    IPC: B64C39/02 ,  B64D33/08 ,  F28D15/02

    Abstract: An innovative passive cooling solution with sealed UAV enclosure system allows heat from a semiconductor chip to be dissipated to the ambient environment through evaporation/condensation phase-change cooling and air cooling a heat sink such as a fin (140) without any additional power consumption to operate cooling solution. One example of such a solution may include a pipe (105) with a fin and a fluid. The pipe may include a wick structure (150) along an inner surface of the pipe configured to allow the fluid to travel within the wick structure and to allow a vapor form of the fluid to exit the wick structure towards a center of the pipe.

    PACKAGE-ON-PACKAGE (POP) DEVICE COMPRISING BI-DIRECTIONAL THERMAL ELECTRIC COOLER
    4.
    发明专利
    PACKAGE-ON-PACKAGE (POP) DEVICE COMPRISING BI-DIRECTIONAL THERMAL ELECTRIC COOLER 未知

    公开(公告)号：CA2981824A1

    公开(公告)日：2016-11-17

    申请号：CA2981824

    申请日：2016-05-10

    Applicant: QUALCOMM INC

    Inventor： MITTAL RAJAT ,  PARK HEE JUN ,  WANG PENG ,  SAEIDI MEHDI ,  MITTAL ARPIT

    IPC: H01L25/065 ,  H01L23/34 ,  H01L23/38 ,  H01L25/10

    Abstract: A package-on-package (PoP) device includes a first package, a second package, and a bi-directional thermal electric cooler (TEC). The first package includes a first substrate and a first die coupled to the first substrate. The second package is coupled to the first package. The second package includes a second substrate and a second die coupled to the second substrate. The TEC is located between the first die and the second substrate. The TEC is adapted to dynamically dissipate heat back and forth between the first package and the second package. The TEC is adapted to dissipate heat from the first die to the second die in a first time period. The TEC is further adapted to dissipate heat from the second die to the first die in a second time period. The TEC is adapted to dissipate heat from the first die to the second die through the second substrate.

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