公开(公告)号：WO2021231021A1

公开(公告)日：2021-11-18

申请号：PCT/US2021/027338

申请日：2021-04-14

Applicant: QUALCOMM INCORPORATED

Inventor： CHAMAS, Ibrahim Ramez ,  ABOUZIED, Mohamed ,  ASURI, Bhushan Shanti

IPC: H01L23/00 ,  H01L23/522 ,  H01L23/58 ,  H01L23/66 ,  H01L2223/6638 ,  H01L2223/6655 ,  H01L2223/6661 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/13012 ,  H01L2224/13026 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/1416 ,  H01L2224/16227 ,  H01L2224/17517 ,  H01L23/5227 ,  H01L23/562 ,  H01L23/585 ,  H01L23/645 ,  H01L24/13 ,  H01L2924/19051 ,  H01L2924/3512 ,  H01L2924/381 ,  H03H7/42 ,  H04B1/40

Abstract: An RF flip chip is provided in which a local bump region adjacent a die comer includes a balun having a centrally-located bump. The centrally-located bump may be floating with respect to signaling within the balun. The local bump region includes a crack stop region at the die comer in which bumps are excluded. The local bump region also includes at least one output bump for the balun.

公开(公告)号：WO2023038792A1

公开(公告)日：2023-03-16

申请号：PCT/US2022/041205

申请日：2022-08-23

Applicant: QUALCOMM INCORPORATED

Inventor： ABOUZIED, Mohamed ,  PANIKKATH, Vinod ,  LIU, Li ,  WANG, Chuan

IPC: G01R21/01

Abstract: An aspect relates to an apparatus including a radio frequency (RF) signal power detector. The RF signal power detector includes a first current source configured to generate a first current based on a power level of a first RF signal; a transimpedance amplifier (TIA) configured to generate a first voltage based on the first current, wherein the TIA is coupled between a first upper voltage rail and a lower voltage rail; and a second current source configured to generate a second current related to the first current, wherein the first and second current sources are coupled in series between a second upper voltage rail and the lower voltage rail.

公开(公告)号：WO2021225733A1

公开(公告)日：2021-11-11

申请号：PCT/US2021/026249

申请日：2021-04-07

Applicant: QUALCOMM INCORPORATED

Inventor： ABOUZIED, Mohamed ,  CHAMAS, Ibrahim Ramez ,  ASURI, Bhushan Shanti ,  ELHADIDY, Osama

IPC: H03D7/14 ,  H03D7/16

Abstract: Certain aspects provide a circuit for frequency conversion. The circuit includes first mixer circuitry coupled to a load circuit and having a first mixer configured to generate a first portion of a frequency-converted differential signal to be provided to the load circuit based on first differential input signals and second differential input signals, and a second mixer configured to generate a second portion of the frequency-converted differential signal based on third differential input signals and fourth differential input signals. The circuit also includes second mixer circuitry coupled to another load circuit and having a third mixer configured to generate a first portion of another frequency-converted differential signal based on the first differential input signals and the fourth differential input signals, and a fourth mixer configured to generate a second portion of the other frequency-converted differential signal based on the third differential input signals and the second differential input signals.

公开(公告)号：EP4399533A1

公开(公告)日：2024-07-17

申请号：EP22772683.3

申请日：2022-08-23

Applicant: QUALCOMM INCORPORATED

Inventor： ABOUZIED, Mohamed ,  PANIKKATH, Vinod ,  LIU, Li ,  WANG, Chuan

IPC: G01R21/01

CPC classification number: G01R21/01

公开(公告)号：EP4150666A1

公开(公告)日：2023-03-22

申请号：EP21723827.8

申请日：2021-04-14

Applicant: QUALCOMM INCORPORATED

Inventor： CHAMAS, Ibrahim Ramez ,  ABOUZIED, Mohamed ,  ASURI, Bhushan Shanti

IPC: H01L23/00 ,  H01L23/522 ,  H01L23/58 ,  H01L23/66

公开(公告)号：EP4147351A1

公开(公告)日：2023-03-15

申请号：EP21721358.6

申请日：2021-04-07

Applicant: QUALCOMM Incorporated

Inventor： ABOUZIED, Mohamed ,  CHAMAS, Ibrahim Ramez ,  ASURI, Bhushan Shanti ,  ELHADIDY, Osama

IPC: H03D7/14 ,  H03D7/16