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公开(公告)号：WO2022076701A1
公开(公告)日：2022-04-14
申请号：PCT/US2021/053994
申请日：2021-10-07
Applicant: QUALCOMM INCORPORATED
Inventor： CAO, Keming , RAMASUBRAMONIAN, Adarsh Krishnan , VAN DER AUWERA, Geert , LIMA, John Steven , BRUNNER, Christopher , KARCZEWICZ, Marta , RAY, Bappaditya
IPC: H04N19/527 , G05D1/02 , H04N19/54 , H04N19/56
Abstract: A device for encoding point cloud data, the device comprising: a memory to store the point cloud data; and one or more processors coupled to the memory and implemented in circuitry, the one or more processors configured to identify a first set of global motion parameters from global positioning system information. The one or more processors are further configured to determine, based on the first set of global motion parameters, a second set of global motion parameters to be used for global motion estimation for a current frame and apply, based on the second set of global motion parameters, motion compensation to a reference frame to generate a global motion compensated frame for the current frame.
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公开(公告)号：WO2022256825A1
公开(公告)日：2022-12-08
申请号：PCT/US2022/072723
申请日：2022-06-02
Applicant: QUALCOMM INCORPORATED
Inventor： CAO, Keming , HU, Nan , SEREGIN, Vadim , KARCZEWICZ, Marta
IPC: H04N19/11 , H04N19/146 , H04N19/176 , H04N19/593
Abstract: A method of encoding or decoding video data comprises: for each respective intra prediction mode of a plurality of intra prediction modes in a most-probable mode (MPM) list: generating, based on reference samples for a template region and using the respective intra prediction mode, prediction samples for the template region; and determining a cost for the respective intra prediction mode; determining a first intra prediction mode and a second intra prediction mode in the MPM list having lowest costs; determining a preliminary prediction block for the first intra prediction mode and a preliminary prediction block for the second intra prediction mode; generating a prediction block based on a fusion of the preliminary prediction blocks weighted according to a weight for the first intra prediction mode and a weight for the second intra prediction mode.
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公开(公告)号：EP4409884A1
公开(公告)日：2024-08-07
申请号：EP22786708.2
申请日：2022-09-15
Applicant: QUALCOMM INCORPORATED
Inventor： CAO, Keming , SEREGIN, Vadim , KARCZEWICZ, Marta
IPC: H04N19/11 , H04N19/136 , H04N19/176
CPC classification number: H04N19/11 , H04N19/136 , H04N19/176
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公开(公告)号：EP4552316A1
公开(公告)日：2025-05-14
申请号：EP23741896.7
申请日：2023-06-23
Applicant: Qualcomm Incorporated
Inventor： CAO, Keming , RAY, Bappaditya , CHANG, Yao-Jen , SEREGIN, Vadim , KARCZEWICZ, Marta
IPC: H04N19/105 , H04N19/11 , H04N19/157 , H04N19/176 , H04N19/182 , H04N19/593 , H04N19/82
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公开(公告)号：EP4508853A1
公开(公告)日：2025-02-19
申请号：EP23718098.9
申请日：2023-03-21
Applicant: QUALCOMM INCORPORATED
Inventor： CAO, Keming , SEREGIN, Vadim , KARCZEWICZ, Marta
IPC: H04N19/176 , H04N19/513 , H04N19/52 , H04N19/593 , H04N19/70
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Patent Agency Ranking
公开(公告)号：EP4508840A1
公开(公告)日：2025-02-19
申请号：EP23719128.3
申请日：2023-03-22
Applicant: QUALCOMM INCORPORATED
Inventor： CHANG, Yao-Jen , CAO, Keming , RAY, Bappaditya , SEREGIN, Vadim , KARCZEWICZ, Marta
IPC: H04N19/11 , H04N19/186 , H04N19/503 , H04N19/593
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公开(公告)号：EP4324197A1
公开(公告)日：2024-02-21
申请号：EP22720899.8
申请日：2022-04-12
Applicant: QUALCOMM Incorporated
Inventor： RAY, Bappaditya , COBAN, Muhammed Zeyd , KEROFSKY, Louis Joseph , SEREGIN, Vadim , KARCZEWICZ, Marta , CAO, Keming
IPC: H04N19/11 , H04N19/12 , H04N19/176 , H04N19/61 , H04N19/70
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公开(公告)号：EP4552315A1
公开(公告)日：2025-05-14
申请号：EP23741883.5
申请日：2023-06-22
Applicant: QUALCOMM INCORPORATED
Inventor： CHANG, Yao-Jen , CAO, Keming , SEREGIN, Vadim , KARCZEWICZ, Marta
IPC: H04N19/105 , H04N19/11 , H04N19/117 , H04N19/176 , H04N19/186 , H04N19/46 , H04N19/59 , H04N19/593 , H04N19/82
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公开(公告)号：EP4409876A1
公开(公告)日：2024-08-07
申请号：EP22785902.2
申请日：2022-09-14
Applicant: QUALCOMM Incorporated
Inventor： CAO, Keming , CHANG, Yao-Jen , RAY, Bappaditya , SEREGIN, Vadim , KARCZEWICZ, Marta
IPC: H04N19/105 , H04N19/159 , H04N19/176 , H04N19/593 , H04N19/463
CPC classification number: H04N19/105 , H04N19/159 , H04N19/176 , H04N19/593 , H04N19/463
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公开(公告)号：EP4349011A1
公开(公告)日：2024-04-10
申请号：EP22736128.4
申请日：2022-06-02
Applicant: QUALCOMM Incorporated
Inventor： CAO, Keming , HU, Nan , SEREGIN, Vadim , KARCZEWICZ, Marta
IPC: H04N19/11 , H04N19/146 , H04N19/176 , H04N19/593
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