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    MULTI-LAYER HEAT DISSIPATING DEVICE COMPRISING HEAT STORAGE CAPABILITIES, FOR AN ELECTRONIC DEVICE
    1.
    发明申请
    MULTI-LAYER HEAT DISSIPATING DEVICE COMPRISING HEAT STORAGE CAPABILITIES, FOR AN ELECTRONIC DEVICE 审中-公开
    包括热存储能力的多层散热装置，用于电子装置

    公开(公告)号：WO2018026484A1

    公开(公告)日：2018-02-08

    申请号：PCT/US2017/041780

    申请日：2017-07-12

    Applicant: QUALCOMM INCORPORATED

    Inventor： ROSALES, Jorge ,  CHIRIAC, Victor

    IPC: H01L23/36 ,  H01L23/427 ,  H01L23/367 ,  H05K7/20

    Abstract: A heat dissipating device that includes a first heat spreader layer, a second heat spreader layer, a first spacer, a second spacer, a first phase change material (PCM), and a second phase change material (PCM). The first heat spreader layer includes a first spreader surface and a second spreader surface. The second heat spreader layer includes a third spreader surface and a fourth spreader surface. The first spacer is coupled to the first heat spreader layer and the second heat spreader layer. The second spacer is coupled to the first heat spreader layer and the second heat spreader layer. The first PCM is located between the first heat spreader layer and the second heat spreader layer. The first PCM is surrounded by the first spacer. The second PCM is between the first heat spreader layer, the second heat spreader layer, the first spacer and the second spacer.

    Abstract translation: 包括第一散热器层，第二散热器层，第一间隔件，第二间隔件，第一相变材料（PCM）和第二相变材料（PCM）的散热装置（ PCM）。 第一散热器层包括第一散热器表面和第二散热器表面。 第二散热器层包括第三散热器表面和第四散热器表面。 第一间隔件耦合到第一散热器层和第二散热器层。 第二间隔件耦合到第一散热器层和第二散热器层。 第一PCM位于第一散热器层和第二散热器层之间。 第一个PCM由第一个隔离物包围。 第二PCM位于第一散热器层，第二散热器层，第一间隔件和第二间隔件之间。

    MULTI-PHASE HEAT DISSIPATING DEVICE EMBEDDED IN AN ELECTRONIC DEVICE
    3.
    发明申请
    MULTI-PHASE HEAT DISSIPATING DEVICE EMBEDDED IN AN ELECTRONIC DEVICE 审中-公开
    嵌入在电子设备中的多相加热消散装置

    公开(公告)号：WO2018031218A1

    公开(公告)日：2018-02-15

    申请号：PCT/US2017/043253

    申请日：2017-07-21

    Applicant: QUALCOMM INCORPORATED

    Inventor： CHIRIAC, Victor ,  ROSALES, Jorge ,  ANDERSON, Jon ,  MOLLOY, Stephen

    IPC: G06F1/20 ,  F28D15/02

    Abstract: A device that includes a region comprising an integrated device and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a first condenser configured to condense the fluid, where the first condenser is located in a first wall of the device, an evaporation portion coupled to the evaporator and the first condenser, and a collection portion coupled to the first condenser and the evaporator. The evaporation portion is configured to channel an evaporated fluid from the evaporator to the first condenser. The collection portion is configured to channel a condensed fluid from the first condenser to the evaporator through the help of gravity.

    Abstract translation: 包括包含集成装置的区域和耦合到包括集成装置的区域的散热装置的装置。 散热装置被配置为从该区域消散热量。 散热装置包括流体，构造成蒸发流体的蒸发器，构造成冷凝流体的第一冷凝器，其中第一冷凝器位于装置的第一壁中，蒸发部分联接至蒸发器和第一冷凝器 以及连接到第一冷凝器和蒸发器的收集部分。 蒸发部分构造成将来自蒸发器的蒸发流体引导至第一冷凝器。 收集部分构造成通过重力将来自第一冷凝器的冷凝流体引导至蒸发器。

    MULTI-ROTOR AERIAL DRONE WITH VAPOR CHAMBER
    5.
    发明申请
    MULTI-ROTOR AERIAL DRONE WITH VAPOR CHAMBER 审中-公开

    公开(公告)号：WO2018231511A1

    公开(公告)日：2018-12-20

    申请号：PCT/US2018/034942

    申请日：2018-05-29

    Applicant: QUALCOMM INCORPORATED

    Inventor： ROSALES, Jorge ,  CHIRIAC, Victor ,  CORLETO MENA, Jose Gilberto

    IPC: B64C39/02 ,  F28D15/02

    Abstract: Some novel features pertain to a quad-rotor or other unmanned aerial drone having a planar vapor chamber mounted to a processor of the drone to cool the processor. The processor may be enclosed in a protective central housing. The vapor chamber is mounted, in some examples, with a perimeter of the vapor chamber extending from the processor through the housing into an airflow region near the rotors of the drone so that airflow, which may include propeller wash, serves to cool the perimeter of the vapor chamber. With this design, the planar vapor chamber cools the enclosed processor using both phase-change cooling / heat spreading (i.e. heat is dissipated from the processor via evaporation and subsequent condensation) and convection (i.e. airflow passing over the perimeter of the vapor chamber carries heat away). In some examples, the planar vapor chamber is turtle-shaped with legs aligned with the struts of the drone.

    MULTI-PHASE HEAT DISSIPATING DEVICE EMBEDDED IN AN ELECTRONIC DEVICE
    6.
    发明公开
    MULTI-PHASE HEAT DISSIPATING DEVICE EMBEDDED IN AN ELECTRONIC DEVICE 审中-公开

    公开(公告)号：EP3497540A1

    公开(公告)日：2019-06-19

    申请号：EP17746603.4

    申请日：2017-07-21

    Applicant: Qualcomm Incorporated

    Inventor： CHIRIAC, Victor ,  ROSALES, Jorge ,  ANDERSON, Jon ,  MOLLOY, Stephen

    IPC: G06F1/20 ,  F28D15/02

    Abstract: A device that includes a region comprising an integrated device and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a first condenser configured to condense the fluid, where the first condenser is located in a first wall of the device, an evaporation portion coupled to the evaporator and the first condenser, and a collection portion coupled to the first condenser and the evaporator. The evaporation portion is configured to channel an evaporated fluid from the evaporator to the first condenser. The collection portion is configured to channel a condensed fluid from the first condenser to the evaporator through the help of gravity.

    MULTI-LAYER HEAT DISSIPATING DEVICE COMPRISING HEAT STORAGE CAPABILITIES, FOR AN ELECTRONIC DEVICE
    10.
    发明公开
    MULTI-LAYER HEAT DISSIPATING DEVICE COMPRISING HEAT STORAGE CAPABILITIES, FOR AN ELECTRONIC DEVICE 审中-公开

    公开(公告)号：EP3494595A1

    公开(公告)日：2019-06-12

    申请号：EP17751504.6

    申请日：2017-07-12

    Applicant: Qualcomm Incorporated

    Inventor： ROSALES, Jorge ,  CHIRIAC, Victor

    IPC: H01L23/36 ,  H01L23/427 ,  H01L23/367 ,  H05K7/20

    Abstract: A heat dissipating device that includes a first heat spreader layer, a second heat spreader layer, a first spacer, a second spacer, a first phase change material (PCM), and a second phase change material (PCM). The first heat spreader layer includes a first spreader surface and a second spreader surface. The second heat spreader layer includes a third spreader surface and a fourth spreader surface. The first spacer is coupled to the first heat spreader layer and the second heat spreader layer. The second spacer is coupled to the first heat spreader layer and the second heat spreader layer. The first PCM is located between the first heat spreader layer and the second heat spreader layer. The first PCM is surrounded by the first spacer. The second PCM is between the first heat spreader layer, the second heat spreader layer, the first spacer and the second spacer.

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