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    SYSTEM AND METHOD FOR ESTIMATING AMBIENT TEMPERATURE OF A PORTABLE COMPUTING DEVICE USING A VOICE COIL
    1.
    发明申请
    SYSTEM AND METHOD FOR ESTIMATING AMBIENT TEMPERATURE OF A PORTABLE COMPUTING DEVICE USING A VOICE COIL 审中-公开
    使用声音线圈估算便携式计算机设备的环境温度的系统和方法

    公开(公告)号：WO2014204813A2

    公开(公告)日：2014-12-24

    申请号：PCT/US2014/042364

    申请日：2014-06-13

    Applicant: QUALCOMM INCORPORATED

    Inventor： VADAKKANMARUVEEDU, Unnikrishnan ,  ZHAO, Zenghui ,  MITTER, Vinay ,  SILVERSTEIN, Roy ,  JAIN, Ankur ,  ANDERSON, Jon

    IPC: G01K7/16 ,  G05D23/20

    CPC classification number: G01K7/16 ,  G05D23/1917 ,  G05D23/20 ,  G05D23/24 ,  G06F1/206

    Abstract: Various embodiments of methods and systems for estimating environmental ambient temperature of a portable computing device ("PCD") from electrical resistance measurements taken voice coils in a speaker or microphone component are disclosed. In an exemplary embodiment, it may be recognized that the PCD is in an idle state, thus producing little or no thermal energy. Electrical resistance measurements are taken from a voice coil and used to estimate the environmental ambient temperature to which the PCD is exposed. Certain embodiments may simply render the estimated ambient temperature for the benefit of the user or use the estimated ambient temperature as an input to a program or application running on the PCD. It is envisioned that certain embodiments of the systems and methods may use the estimated ambient temperature to adjust temperature thresholds in the PCD against which thermal management policies govern thermally aggressive processing components.

    Abstract translation: 公开了用于通过扬声器或麦克风组件中的音圈的电阻测量来估计便携式计算设备（“PCD”）的环境温度的方法和系统的各种实施例。 在示例性实施例中，可以认识到PCD处于空闲状态，因此产生很少的或没有热能。 电阻测量取自音圈，用于估计PCD暴露于的环境温度。 某些实施例可以简单地使估计的环境温度为用户的利益或使用估计的环境温度作为在PCD上运行的程序或应用的输入。 可以设想，系统和方法的某些实施例可以使用估计的环境温度来调整PCD中的温度阈值，热管理策略对该温度阈值控制热侵蚀性处理组件。

    SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF A WEARABLE COMPUTING DEVICE BASED ON PROXIMITY TO A USER
    2.
    发明申请
    SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF A WEARABLE COMPUTING DEVICE BASED ON PROXIMITY TO A USER 审中-公开

    公开(公告)号：WO2018144767A1

    公开(公告)日：2018-08-09

    申请号：PCT/US2018/016501

    申请日：2018-02-01

    Applicant: QUALCOMM INCORPORATED

    Inventor： SAHU, Vivek ,  LE, Don ,  ANDERSON, Jon ,  WANG, Peng ,  WANG, Shujuan

    IPC: G06F1/20 ,  G06F1/32 ,  H04M1/725 ,  H04W52/02

    Abstract: Because the touch temperature of a wearable computing device ("WCD") may be an insignificant factor for user experience when the WCD is not being worn by a user, embodiments of the solution seek to modify thermal management policies based on an inferred user proximity state. Exemplary embodiments monitor one or more signals from readily available sensors in the WCD that have primary purposes other than measuring user proximity. Depending on embodiment, the sensors may be selected from a group consisting of a heart rate monitor, a pulse monitor, an O2 sensor, a bio-impedance sensor, a gyroscope, an accelerometer, a temperature sensor, a pressure sensor, a capacitive sensor, a resistive sensor and a light sensor. Using the signals generated by such sensors, relative physical proximity of the WCD to a user may be inferred and, based on the user proximity state, thermal policies either relaxed or tightened.

    MULTI-PHASE HEAT DISSIPATING DEVICE EMBEDDED IN AN ELECTRONIC DEVICE
    3.
    发明申请
    MULTI-PHASE HEAT DISSIPATING DEVICE EMBEDDED IN AN ELECTRONIC DEVICE 审中-公开
    嵌入在电子设备中的多相加热消散装置

    公开(公告)号：WO2018031218A1

    公开(公告)日：2018-02-15

    申请号：PCT/US2017/043253

    申请日：2017-07-21

    Applicant: QUALCOMM INCORPORATED

    Inventor： CHIRIAC, Victor ,  ROSALES, Jorge ,  ANDERSON, Jon ,  MOLLOY, Stephen

    IPC: G06F1/20 ,  F28D15/02

    Abstract: A device that includes a region comprising an integrated device and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a first condenser configured to condense the fluid, where the first condenser is located in a first wall of the device, an evaporation portion coupled to the evaporator and the first condenser, and a collection portion coupled to the first condenser and the evaporator. The evaporation portion is configured to channel an evaporated fluid from the evaporator to the first condenser. The collection portion is configured to channel a condensed fluid from the first condenser to the evaporator through the help of gravity.

    Abstract translation: 包括包含集成装置的区域和耦合到包括集成装置的区域的散热装置的装置。 散热装置被配置为从该区域消散热量。 散热装置包括流体，构造成蒸发流体的蒸发器，构造成冷凝流体的第一冷凝器，其中第一冷凝器位于装置的第一壁中，蒸发部分联接至蒸发器和第一冷凝器 以及连接到第一冷凝器和蒸发器的收集部分。 蒸发部分构造成将来自蒸发器的蒸发流体引导至第一冷凝器。 收集部分构造成通过重力将来自第一冷凝器的冷凝流体引导至蒸发器。

    SYSTEMS, METHODS, AND APPARATUS FOR PASSIVE COOLING OF UAVS
    4.
    发明申请
    SYSTEMS, METHODS, AND APPARATUS FOR PASSIVE COOLING OF UAVS 审中-公开

    公开(公告)号：WO2018118383A1

    公开(公告)日：2018-06-28

    申请号：PCT/US2017/064208

    申请日：2017-12-01

    Applicant: QUALCOMM INCORPORATED

    Inventor： WANG, Peng ,  LE, Don ,  ANDERSON, Jon ,  CHIU, Chinchuan, Andrew

    IPC: B64C39/02 ,  B64D33/08 ,  F28D15/02

    Abstract: An innovative passive cooling solution with sealed UAV enclosure system allows heat from a semiconductor chip to be dissipated to the ambient environment through evaporation/condensation phase-change cooling and air cooling a heat sink such as a fin (140) without any additional power consumption to operate cooling solution. One example of such a solution may include a pipe (105) with a fin and a fluid. The pipe may include a wick structure (150) along an inner surface of the pipe configured to allow the fluid to travel within the wick structure and to allow a vapor form of the fluid to exit the wick structure towards a center of the pipe.

    MULTI-PHASE HEAT DISSIPATING DEVICE EMBEDDED IN AN ELECTRONIC DEVICE
    10.
    发明公开
    MULTI-PHASE HEAT DISSIPATING DEVICE EMBEDDED IN AN ELECTRONIC DEVICE 审中-公开

    公开(公告)号：EP3497540A1

    公开(公告)日：2019-06-19

    申请号：EP17746603.4

    申请日：2017-07-21

    Applicant: Qualcomm Incorporated

    Inventor： CHIRIAC, Victor ,  ROSALES, Jorge ,  ANDERSON, Jon ,  MOLLOY, Stephen

    IPC: G06F1/20 ,  F28D15/02

    Abstract: A device that includes a region comprising an integrated device and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a first condenser configured to condense the fluid, where the first condenser is located in a first wall of the device, an evaporation portion coupled to the evaporator and the first condenser, and a collection portion coupled to the first condenser and the evaporator. The evaporation portion is configured to channel an evaporated fluid from the evaporator to the first condenser. The collection portion is configured to channel a condensed fluid from the first condenser to the evaporator through the help of gravity.

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