公开(公告)号：WO2021178156A1

公开(公告)日：2021-09-10

申请号：PCT/US2021/019046

申请日：2021-02-22

Applicant: QUALCOMM INCORPORATED

Inventor： HAN, Jeahyeong ,  KUMAR, Rajneesh ,  HWANG, Suhyung ,  YEON, Jaehyun ,  TASSOUDJI, Mohammad Ali ,  JESSIE, Darryl Sheldon ,  GALINDE, Ameya

IPC: H01Q21/28 ,  H01Q1/22 ,  H05K1/02 ,  H05K3/46 ,  H01L23/552 ,  H01L23/66

Abstract: A device that includes a first substrate comprising a first antenna, an integrated device coupled to the first substrate, an encapsulation layer located over the first substrate and the integrated device, a second substrate comprising a second antenna, and a flexible connection coupled to the first substrate and the second substrate. The device includes a shield formed over a surface of the encapsulation layer and a surface of the first substrate. The shield includes an electromagnetic interference (EMI) shield.

公开(公告)号：WO2021112978A1

公开(公告)日：2021-06-10

申请号：PCT/US2020/057826

申请日：2020-10-29

Applicant: QUALCOMM INCORPORATED

Inventor： ZHANG, Chaoqi ,  KUMAR, Rajneesh ,  WENG, Li-Sheng ,  JESSIE, Darryl Sheldon ,  HWANG, Suhyung ,  HAN, Jeahyeong ,  CHEN, Xiaoming ,  YEON, Jaehyun

IPC: H01L23/498 ,  H01L23/552 ,  H01L21/56 ,  H01L23/31 ,  H05K1/02

Abstract: A package that includes a substrate having a routing region and a non-routing region along a periphery of the substrate. The non-routing region includes a plurality of vias configured as a shield. The package includes an integrated device coupled to the substrate, and an encapsulation layer located over the substrate such that the encapsulation layer encapsulates the integrated device.

公开(公告)号：WO2022246355A1

公开(公告)日：2022-11-24

申请号：PCT/US2022/071846

申请日：2022-04-21

Applicant: QUALCOMM INCORPORATED

Inventor： LEE, Hong-Ming ,  JESSIE, Darryl Sheldon

IPC: H04B1/04 ,  H04B1/18 ,  H03H7/38

Abstract: An apparatus is disclosed for implementing an antenna tuner. In an example aspect, the apparatus includes a substrate, an antenna disposed on or in the substrate, a radio-frequency integrated circuit disposed on the substrate, and an antenna tuner. The radio-frequency integrated circuit includes an amplification circuit. The antenna tuner is coupled between the antenna and the amplification circuit. The antenna tuner includes an inductive component disposed on or in the substrate and a capacitive component implemented within the radio-frequency integrated circuit.

公开(公告)号：EP4342088A1

公开(公告)日：2024-03-27

申请号：EP22722992.9

申请日：2022-04-21

Applicant: QUALCOMM INCORPORATED

Inventor： LEE, Hong-Ming ,  JESSIE, Darryl Sheldon

IPC: H04B1/04 ,  H04B1/18 ,  H03H7/38

公开(公告)号：EP4115474A1

公开(公告)日：2023-01-11

申请号：EP21712620.0

申请日：2021-02-22

Applicant: QUALCOMM INCORPORATED

Inventor： HAN, Jeahyeong ,  KUMAR, Rajneesh ,  HWANG, Suhyung ,  YEON, Jaehyun ,  TASSOUDJI, Mohammad Ali ,  JESSIE, Darryl Sheldon ,  GALINDE, Ameya

IPC: H01Q21/28 ,  H01Q1/22 ,  H05K1/02 ,  H05K3/46 ,  H01L23/552 ,  H01L23/66

公开(公告)号：EP4070372A1

公开(公告)日：2022-10-12

申请号：EP20811481.9

申请日：2020-10-29

Applicant: QUALCOMM INCORPORATED

Inventor： ZHANG, Chaoqi ,  KUMAR, Rajneesh ,  WENG, Li-Sheng ,  JESSIE, Darryl Sheldon ,  HWANG, Suhyung ,  HAN, Jeahyeong ,  CHEN, Xiaoming ,  YEON, Jaehyun

IPC: H01L23/498 ,  H01L23/552 ,  H01L21/56 ,  H01L23/31 ,  H05K1/02