公开(公告)号：EP4497124A1

公开(公告)日：2025-01-29

申请号：EP23713200.6

申请日：2023-02-28

Applicant: QUALCOMM INCORPORATED

Inventor： KHOSLA, Abha ,  DAS, Soumya ,  KATAMREDDY, Srujith, Reddy ,  DASAM, Phani, Kumar ,  RAMASAMY, Bala

IPC: G08G1/00

公开(公告)号：EP4483633A1

公开(公告)日：2025-01-01

申请号：EP22854577.8

申请日：2022-12-23

Applicant: QUALCOMM INCORPORATED

Inventor： KATAMREDDY, Srujith Reddy ,  KHOSLA, Abha ,  DASAM, Phani Kumar ,  SHUMAN, Mohammed Ataur Rahman ,  DAS, Soumya

IPC: H04W56/00

公开(公告)号：EP4469989A1

公开(公告)日：2024-12-04

申请号：EP22840409.1

申请日：2022-11-22

Applicant: QUALCOMM INCORPORATED

Inventor： KHOSLA, Abha ,  SHUMAN, Mohammed Ataur Rahman ,  DAS, Soumya ,  KATAMREDDY, Srujith Reddy ,  DASAM, Phani Kumar

IPC: G08G1/0967 ,  B60W30/18 ,  B60W60/00 ,  H04W4/44

公开(公告)号：EP4552304A1

公开(公告)日：2025-05-14

申请号：EP23739404.4

申请日：2023-06-08

Applicant: QUALCOMM INCORPORATED

Inventor： GUMMADI, Bapineedu Chowdary ,  EDGE, Stephen William ,  POTHIREDDY, Amarnath Reddy ,  REDDY, Yatham Sai Sangram ,  RAMASAMY, Bala ,  MANDAL, Suryakanta ,  TANGIRALA, Phani Kumar Jagannadha ,  CHEEKATLA, Phaneendra ,  KATAMREDDY, Srujith Reddy ,  KHOSLA, Abha ,  NGUYEN, Thien

IPC: H04L67/12

公开(公告)号：EP4544530A1

公开(公告)日：2025-04-30

申请号：EP23735926.0

申请日：2023-06-07

Applicant: QUALCOMM Incorporated

Inventor： KHOSLA, Abha ,  DAS, Soumya ,  KATAMREDDY, Srujith, Reddy

IPC: G08G1/01 ,  G08G1/0967 ,  G08G1/16

公开(公告)号：EP4497125A1

公开(公告)日：2025-01-29

申请号：EP23708974.3

申请日：2023-02-02

Applicant: QUALCOMM INCORPORATED

Inventor： KHOSLA, Abha ,  DAS, Soumya ,  KATAMREDDY, Srujith Reddy ,  DASAM, Phani Kumar

IPC: G08G1/01 ,  G08G1/16

公开(公告)号：EP4324275A1

公开(公告)日：2024-02-21

申请号：EP21936380.1

申请日：2021-04-14

Applicant: QUALCOMM INCORPORATED

Inventor： GU, Guibing ,  HOU, Jintao ,  PARK, Cheol Hee ,  GUO, Hongjin ,  KHOSLA, Abha

IPC: H04W72/04 ,  H04W4/40