公开(公告)号：WO2018031165A1

公开(公告)日：2018-02-15

申请号：PCT/US2017/041578

申请日：2017-07-11

Applicant: QUALCOMM INCORPORATED

Inventor： JAROSINSKI, Tadeusz ,  SLOBODYANYUK, Volodimir ,  WYRWAS, John ,  RAINA, Manav ,  MCLAREN, Elbert

IPC: G01S7/481 ,  G01S7/486 ,  G01S17/42

Abstract: Disclosed herein are techniques for measuring a reference beam and a corresponding returned beam from a target in a measurement system using a single sensor array. The system is configured such that the location of the reference beam is space apart from the location of the returned beam on the sensor array. A first set of sensor elements on the sensor array corresponding to the reference beam is dynamically activated based on a laser beam scanning control signal. The detection signal from the first set of sensor elements is used to determine a location and/or a pattern of the reference beam, which are then used to estimate a location and/or a pattern of the corresponding returned beam on the same sensor array and dynamically select and activate a second set of sensor elements on the sensor array based on the estimated location and/or pattern of the corresponding returned beam.

Abstract translation: 这里公开了用于使用单个传感器阵列测量来自测量系统中的目标的参考光束和相应的返回光束的技术。 该系统被配置为使得参考光束的位置与传感器阵列上的返回光束的位置间隔开。 基于激光束扫描控制信号动态地激活传感器阵列上对应于参考光束的第一组传感器元件。 来自第一组传感器元件的检测信号用于确定参考光束的位置和/或图案，然后将其用于估计相同传感器阵列上的相应返回光束的位置和/或图案，并且 基于估计的相应返回光束的位置和/或图案动态地选择和激活传感器阵列上的第二组传感器元件。

公开(公告)号：WO2018035242A1

公开(公告)日：2018-02-22

申请号：PCT/US2017/047176

申请日：2017-08-16

Applicant: QUALCOMM INCORPORATED

Inventor： SHENOY, Ravindra ,  SAUHTA, Rohit ,  MCLAREN, Elbert ,  SITACHITT, Sidney ,  KIDWELL, Donald William Jr.

IPC: H04R1/10 ,  H04R25/00

Abstract: A device that includes a board, a first integrated device coupled to the board, a speaker coupled to the first integrated device, a microphone coupled to the first integrated device and a power source configured to provide power to the first integrated device, the speaker and the microphone. The device has a length of about 2.4 centimeter (cm) or less, and a diameter of about 1.2 centimeter (cm) or less. The first integrated device includes a processor. The device further includes a second integrated device configured to provide wireless communication capabilities. The device further includes a wireless charging circuit to enable wireless charging of the power source.

Abstract translation: 包括板，耦合到板的第一集成设备，耦合到第一集成设备的扬声器，耦合到第一集成设备的麦克风和配置为向 第一个集成设备，扬声器和麦克风。 该装置具有约2.4厘米（cm）或更小的长度，以及约1.2厘米（cm）或更小的直径。 第一个集成设备包括一个处理器。 该设备还包括被配置为提供无线通信能力的第二集成设备。 该设备还包括无线充电电路，以实现电源的无线充电。

公开(公告)号：EP3501181A1

公开(公告)日：2019-06-26

申请号：EP17758371.3

申请日：2017-08-16

Applicant: Qualcomm Incorporated

Inventor： SHENOY, Ravindra ,  SAUHTA, Rohit ,  MCLAREN, Elbert ,  SITACHITT, Sidney ,  KIDWELL, Donald William Jr.

IPC: H04R1/10 ,  H04R25/00

公开(公告)号：EP3497469A1

公开(公告)日：2019-06-19

申请号：EP17742910.7

申请日：2017-07-11

Applicant: Qualcomm Incorporated

Inventor： JAROSINSKI, Tadeusz ,  SLOBODYANYUK, Volodimir ,  WYRWAS, John ,  RAINA, Manav ,  MCLAREN, Elbert

IPC: G01S7/481 ,  G01S7/486 ,  G01S17/42

公开(公告)号：EP4002876A3

公开(公告)日：2022-08-24

申请号：EP21217072.4

申请日：2017-08-16

Applicant: QUALCOMM Incorporated

Inventor： SHENOY, Ravindra ,  SAUHTA, Rohit ,  MCLAREN, Elbert ,  SITACHITT, Sidney ,  KIDWELL, Donald William Jr.

IPC: H04R1/10 ,  H04R25/00

Abstract: A device that includes a board, a first integrated device coupled to the board, a speaker coupled to the first integrated device, a microphone coupled to the first integrated device and a power source configured to provide power to the first integrated device, the speaker and the microphone. The device has a length of about 2.4 centimeter (cm) or less, and a diameter of about 1.2 centimeter (cm) or less. The first integrated device includes a processor. The device further includes a second integrated device configured to provide wireless communication capabilities. The device further includes a wireless charging circuit to enable wireless charging of the power source.

公开(公告)号：EP4002876A2

公开(公告)日：2022-05-25

申请号：EP21217072.4

申请日：2017-08-16

Applicant: QUALCOMM Incorporated

Inventor： SHENOY, Ravindra ,  SAUHTA, Rohit ,  MCLAREN, Elbert ,  SITACHITT, Sidney ,  KIDWELL, Donald William Jr.

IPC: H04R1/10 ,  H04R25/00

Abstract: A device that includes a board, a first integrated device coupled to the board, a speaker coupled to the first integrated device, a microphone coupled to the first integrated device and a power source configured to provide power to the first integrated device, the speaker and the microphone. The device has a length of about 2.4 centimeter (cm) or less, and a diameter of about 1.2 centimeter (cm) or less. The first integrated device includes a processor. The device further includes a second integrated device configured to provide wireless communication capabilities. The device further includes a wireless charging circuit to enable wireless charging of the power source.