公开(公告)号：WO2017151239A1

公开(公告)日：2017-09-08

申请号：PCT/US2017/014555

申请日：2017-01-23

Applicant: QUALCOMM INCORPORATED

Inventor： KIDWELL JR., Donald, William ,  SHENOY, Ravindra ,  LASITER, Jon

IPC: B06B1/06 ,  A61B1/04 ,  A61B8/12 ,  A61B8/00 ,  G10K11/00

Abstract: Embodiments of a sensor device and methods for manufacturing the same are disclosed. In one embodiment, a sensor device comprises a piezoelectric micromechanical ultrasonic transducer (PMUT) array configured to transmit and receive ultrasonic signals, where the PMUT array comprises a plurality of PMUTs and the PMUT array is flexible, one or more integrated circuits configured to process the ultrasonic signals, a battery configured to provide power to the PMUT array and the one or more integrated circuits, a coupling material configured to hold the PMUT array, the one or more integrated circuits, and the battery, and a capsule configured to seal the PMUT array, the one or more integrated circuits, the battery and the coupling material within the capsule.

Abstract translation: 公开了传感器装置的实施例及其制造方法。 在一个实施例中，传感器设备包括被配置为发送和接收超声信号的压电微机械超声换能器（PMUT）阵列，其中PMUT阵列包括多个PMUT并且PMUT阵列是柔性的，一个或多个集成电路被配置为处理 超声信号，被配置为向PMUT阵列和一个或多个集成电路提供功率的电池，被配置为保持PMUT阵列，一个或多个集成电路和电池的耦合材料以及被配置为密封PMUT 阵列，一个或多个集成电路，电池和胶囊内的耦合材料。

公开(公告)号：WO2017131915A1

公开(公告)日：2017-08-03

申请号：PCT/US2016/068788

申请日：2016-12-28

Applicant: QUALCOMM INCORPORATED

Inventor： NEWHAM, Adam Edward ,  VON NOVAK, William, Henry, III ,  SHENOY, Ravindra ,  ATTAR, Rashid Ahmed Akbar ,  EASTON, Kenneth David

IPC: A61B17/34 ,  A61B5/145

CPC classification number: H01Q1/273 ,  A61B5/065 ,  A61B5/14503 ,  A61B5/14542 ,  A61B17/3415 ,  A61B17/3468 ,  A61B2560/0219 ,  H01Q1/36 ,  H01Q1/40 ,  H01Q7/00 ,  H04B5/0037

Abstract: A biomedical system includes: a medical implant capsule including an outer body, an electric device retained by the outer body, and a power input coupled to the electric device, the medical implant capsule having a length, along an axis, and a width transverse to the axis; and an antenna coupled to the power input and configured to: receive power wirelessly and to deliver the power to the power input; wrap around the medical implant capsule, in a transit state, transverse to the length of the medical implant capsule for a distance greater than the width of the medical implant capsule; and expand to a deployed state, at least part of the antenna being further from the axis in the deployed state than in the transit state.

Abstract translation: 一种生物医学系统包括：医疗植入物胶囊，其包括外部主体，由所述外部主体保持的电气装置以及耦合到所述电气装置的电力输入，所述医疗植入物胶囊具有沿 轴线和横向于所述轴线的宽度; 以及天线，其耦合到所述电力输入并且被配置为：无线地接收电力并将电力传递到所述电力输入; 以横过所述医疗植入物胶囊的长度的过境状态围绕所述医疗植入物胶囊卷绕一段距离，所述距离大于所述医疗植入物胶囊的宽度; 并展开为展开状态，至少部分天线在展开状态下比在过境状态下离轴更远。

公开(公告)号：WO2017040891A1

公开(公告)日：2017-03-09

申请号：PCT/US2016/050050

申请日：2016-09-02

Applicant: QUALCOMM INCORPORATED

Inventor： KIDWELL, Donald, William ,  SHENOY, Ravindra ,  LASITER, Jon

IPC: B06B1/02 ,  B06B1/06

CPC classification number: B06B1/0292 ,  B06B1/0622 ,  B81B3/0021 ,  B81B3/0097 ,  B81B7/04 ,  B81C1/00134 ,  B81C1/00214 ,  H01L41/332

Abstract: Methods, systems, computer-readable media, and apparatuses for high density Micro-Electro-Mechanical Systems (MEMS) are presented. In some embodiments, a method for manufacturing a micro-electro-mechanical device on a substrate can comprise etching a release via through a layer of the device. The method can further comprise creating a cavity in the layer of the device using the release via as a conduit to access the desired location of the cavity, the cavity enabling movement of a transducer of the device. The method can then comprise depositing low impedance, electrically conductive material into the release via to form an electrically conductive path through the layer. Finally, the method can comprise electrically coupling the electrically conductive material to an electrode of the transducer.

Abstract translation: 提出了用于高密度微机电系统（MEMS）的方法，系统，计算机可读介质和装置。 在一些实施例中，用于在基底上制造微电子机械装置的方法可以包括通过装置的层蚀刻释放通路。 该方法还可以包括使用释放通道作为导管在装置的层中产生空腔，以进入空腔的期望位置，空腔使得能够移动装置的换能器。 该方法然后可以包括将低阻抗导电材料沉积到释放通孔中以形成通过该层的导电路径。 最后，该方法可以包括将导电材料电耦合到换能器的电极。

公开(公告)号：WO2019157055A1

公开(公告)日：2019-08-15

申请号：PCT/US2019/016852

申请日：2019-02-06

Applicant: QUALCOMM INCORPORATED

Inventor： SHELLHAMMER, Stephen Jay ,  ATTAR, Rashid Ahmed Akbar ,  NEWHAM, Adam Edward ,  VON NOVAK, William Henry ,  ALCALA, Osvaldo ,  GARCIA, Jorge ,  BUTTERFIELD, Daniel ,  SHENOY, Ravindra

IPC: A61B5/00

Abstract: A medical system is provided. The medical system includes a guidewire configured to guide a catheter to a target location within a body, the guidewire including a sensor configured to collect sensor data indicative of a location within the body, and an electrical conductor configured to conduct electrical signals representing the sensor data. The medical system further includes a wireless transmitter and a first antenna electrically coupled with the sensor via the electrical conductor and configured to: receive the electrical signals representing the sensor data; generate, from the electrical signals, first wireless signals representing the sensor data; and transmit, via the first antenna, first wireless signals.

公开(公告)号：WO2017151597A1

公开(公告)日：2017-09-08

申请号：PCT/US2017/019916

申请日：2017-02-28

Applicant: QUALCOMM INCORPORATED

Inventor： KIDWELL, Donald William ,  SHENOY, Ravindra ,  LASITER, Jon

IPC: H01L41/09 ,  B06B1/06 ,  H01L41/313 ,  H01L41/331

Abstract: Embodiments of a flexible PMUT array and methods for manufacturing the same are disclosed. In one embodiment, a piezoelectric micromechanical ultrasonic transducer (PMUTs) array comprises a plurality of PMUTs, where each PMUT in the flexible array of PMUTs includes: a first polymer layer configured to support the PMUT, a mechanical layer configured to provide planarization to the PMUT, a first electrode, a second electrode, a piezoelectric layer configured to separate the first electrode and the second electrode, patterns on the first electrode, the piezoelectric material, and the second electrode configured to route electrical signals, and a cavity configured to adjust a frequency response of the PMUT.

Abstract translation: 公开了灵活的PMUT阵列及其制造方法的实施例。 在一个实施例中，压电微机械超声换能器（PMUT）阵列包括多个PMUT，其中PMUT的柔性阵列中的每个PMUT包括：被配置为支撑PMUT的第一聚合物层，被配置为向PMUT提供平面化的机械层 ，第一电极，第二电极，被配置为分离所述第一电极和所述第二电极的压电层，所述第一电极上的图案，所述压电材料和被配置为布设电信号的所述第二电极，以及空腔， PMUT的频率响应。

公开(公告)号：EP3501181A1

公开(公告)日：2019-06-26

申请号：EP17758371.3

申请日：2017-08-16

Applicant: Qualcomm Incorporated

Inventor： SHENOY, Ravindra ,  SAUHTA, Rohit ,  MCLAREN, Elbert ,  SITACHITT, Sidney ,  KIDWELL, Donald William Jr.

IPC: H04R1/10 ,  H04R25/00

公开(公告)号：WO2018035242A1

公开(公告)日：2018-02-22

申请号：PCT/US2017/047176

申请日：2017-08-16

Applicant: QUALCOMM INCORPORATED

Inventor： SHENOY, Ravindra ,  SAUHTA, Rohit ,  MCLAREN, Elbert ,  SITACHITT, Sidney ,  KIDWELL, Donald William Jr.

IPC: H04R1/10 ,  H04R25/00

Abstract: A device that includes a board, a first integrated device coupled to the board, a speaker coupled to the first integrated device, a microphone coupled to the first integrated device and a power source configured to provide power to the first integrated device, the speaker and the microphone. The device has a length of about 2.4 centimeter (cm) or less, and a diameter of about 1.2 centimeter (cm) or less. The first integrated device includes a processor. The device further includes a second integrated device configured to provide wireless communication capabilities. The device further includes a wireless charging circuit to enable wireless charging of the power source.

Abstract translation: 包括板，耦合到板的第一集成设备，耦合到第一集成设备的扬声器，耦合到第一集成设备的麦克风和配置为向 第一个集成设备，扬声器和麦克风。 该装置具有约2.4厘米（cm）或更小的长度，以及约1.2厘米（cm）或更小的直径。 第一个集成设备包括一个处理器。 该设备还包括被配置为提供无线通信能力的第二集成设备。 该设备还包括无线充电电路，以实现电源的无线充电。

公开(公告)号：WO2017165093A1

公开(公告)日：2017-09-28

申请号：PCT/US2017/020123

申请日：2017-03-01

Applicant: QUALCOMM INCORPORATED

Inventor： VON NOVAK III, William Henry ,  CHI, Mei-Li ,  SHENOY, Ravindra ,  ATTAR, Rashid Ahmed Akbar ,  ARABI, Karim ,  KIDWELL JR., Donald ,  LASITER, Jon

IPC: H02J50/50 ,  H02J7/02

Abstract: A method of providing power to an implant includes: transcutaneously receiving first power wirelessly from a source transmitter by a receiver of a power relay device, the receiver of the power relay device being disposed inside a biological body and closer to a skin of the biological body than the implant is to the skin of the biological body; converting the first power into second power that has a substantially different frequency than the first power, or is of different type of power than the first power, or both; and internally coupling the second power from a transmitter of the power relay device to the implant disposed within the biological body.

Abstract translation: 向植入物供电的方法包括：通过功率中继装置的接收器从源发射器无线地经皮接收第一功率，功率中继装置的接收器设置在生物体内并且 与植入物相比生物体的皮肤更接近生物体的皮肤; 将所述第一电力转换成具有与所述第一电力显着不同的频率的第二电力，或者具有与所述第一电力不同的电力类型或者两者; 并且将来自功率中继装置的发射器的第二功率内部耦合到布置在生物体内的植入物。

公开(公告)号：WO2016126881A1

公开(公告)日：2016-08-11

申请号：PCT/US2016/016458

申请日：2016-02-03

Applicant: QUALCOMM INCORPORATED

Inventor： KIDWELL, Donald William, Jr. ,  SHENOY, Ravindra ,  ERTURK, Mete ,  ROUHANA, Layal

IPC: H01L23/498 ,  H01F17/00 ,  H01L21/48

CPC classification number: H01L23/49838 ,  B23K26/0661 ,  H01F17/0033 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/5226 ,  H01L23/5227 ,  H01L23/585 ,  H01L28/10 ,  H01L2224/16227 ,  H01L2924/15311

Abstract: An integrated device package includes a die and a package substrate. The package substrate includes at least one dielectric layer (e.g., core layer, prepeg layer), a magnetic core in the dielectric layer, a first plurality of interconnects configured to operate as a first protective ring, and a second plurality of interconnects configured to operate as a first inductor. The second plurality of interconnects is positioned in the package substrate to at least partially surround the magnetic core. At least one interconnect from the second plurality of interconnects is also part of the first plurality of interconnects. In some implementations, the first protective ring is a non-contiguous protective ring. In some implementations, the first inductor is a solenoid inductor. In some implementations, the magnetic core includes a carrier, a first magnetic layer, and a second magnetic layer.

Abstract translation: 集成器件封装包括管芯和封装衬底。 封装衬底包括至少一个电介质层（例如芯层，预镀层），电介质层中的磁芯，被配置为作为第一保护环工作的第一多个互连件和被构造成操作的第二多个互连件 作为第一电感器。 所述第二多个互连件定位在所述封装衬底中以至少部分地围绕所述磁芯。 来自第二多个互连的至少一个互连也是第一多个互连的一部分。 在一些实施方案中，第一保护环是不连续的保护环。 在一些实施方式中，第一电感器是螺线管电感器。 在一些实施方案中，磁芯包括载体，第一磁性层和第二磁性层。

公开(公告)号：EP3424085A1

公开(公告)日：2019-01-09

申请号：EP17713800.5

申请日：2017-02-28

Applicant: Qualcomm Incorporated

Inventor： KIDWELL JHR., Donald William ,  SHENOY, Ravindra ,  LASITER, Jon

IPC: H01L41/09 ,  B06B1/06 ,  H01L41/313 ,  H01L41/331