公开(公告)号：WO2022231711A1

公开(公告)日：2022-11-03

申请号：PCT/US2022/020268

申请日：2022-03-14

Applicant: QUALCOMM INCORPORATED

Inventor： ARTIERI, Alain ,  GUPTA, Rakesh Kumar ,  PALACHARLA, Subbarao ,  BHOLE, Kedar ,  MOLL, Laurent Rene ,  SPITALE, Carlo ,  SINGHAI, Sparsh ,  THOZIYOOR, Shyamkumar ,  TUMMALA, Gopi ,  AVOINNE, Christophe ,  GINDE, Samir ,  HASSAN, Syed Minhaj ,  LECLER, Jean-Jacques ,  VINCI, Luigi

IPC: G06F12/121

Abstract: Data caching may include storing data associated with DRAM transaction requests in data storage structures organized in a manner corresponding to the DRAM bank, bank group and rank organization. Data may be selected for transfer to the DRAM by selecting among the data storage structures.

公开(公告)号：WO2023009920A1

公开(公告)日：2023-02-02

申请号：PCT/US2022/073007

申请日：2022-06-17

Applicant: QUALCOMM INCORPORATED

Inventor： BHAT, Girish ,  PALACHARLA, Subbarao ,  SHABEL, Jeffrey ,  BERK, Isaac ,  BHOLE, Kedar ,  GANDHI, Vipul ,  PATSILARAS, George ,  SINGHAI, Sparsh

IPC: G06F1/3234

Abstract: Integrated circuits (ICs) employ subsystem shared cache memory for facilitating extension of low-power island (LPI) memory. An LPI subsystem and primary subsystems access a memory subsystem on a first access interface in a first power mode and the LPI subsystem accesses the memory subsystem by a second access interface in the low power mode. In the first power mode, the primary subsystems and the LPI subsystem may send a subsystem memory access request including a virtual memory address to a subsystem memory interface of the memory subsystem to access either data stored in an external memory or a version of the data stored in a shared memory circuit. In the low-power mode, the LPI subsystem sends an LPI memory access request including a direct memory address to an LPI memory interface of the memory subsystem to access the shared memory circuit to extend the LPI memory.

公开(公告)号：EP4377765A1

公开(公告)日：2024-06-05

申请号：EP22741677.3

申请日：2022-06-17

Applicant: QUALCOMM INCORPORATED

Inventor： BHAT, Girish ,  PALACHARLA, Subbarao ,  SHABEL, Jeffrey ,  BERK, Isaac ,  BHOLE, Kedar ,  GANDHI, Vipul ,  PATSILARAS, George ,  SINGHAI, Sparsh

IPC: G06F1/3234

CPC classification number: G06F1/3275 ,  G06F2212/102820130101 ,  G06F12/0864 ,  G06F2212/50220130101 ,  G06F12/084 ,  G06F12/0842 ,  G06F12/0846 ,  G06F12/0292 ,  Y02D10/00

公开(公告)号：EP4330826A1

公开(公告)日：2024-03-06

申请号：EP22715234.5

申请日：2022-03-14

Applicant: QUALCOMM INCORPORATED

Inventor： ARTIERI, Alain ,  GUPTA, Rakesh Kumar ,  PALACHARLA, Subbarao ,  BHOLE, Kedar ,  MOLL, Laurent Rene ,  SPITALE, Carlo ,  SINGHAI, Sparsh ,  THOZIYOOR, Shyamkumar ,  TUMMALA, Gopi ,  AVOINNE, Christophe ,  GINDE, Samir ,  HASSAN, Syed Minhaj ,  LECLER, Jean-Jacques ,  VINCI, Luigi

IPC: G06F12/121