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公开(公告)号：WO2023034658A1
公开(公告)日：2023-03-09
申请号：PCT/US2022/073482
申请日：2022-07-06
Applicant: QUALCOMM INCORPORATED
Inventor： LIN, Shiang-Chi , PANCHAWAGH, Hrishikesh Vijaykumar , STROHMANN, Jessica Liu , LU, Yipeng , TSENG, Chin-Jen , DJORDJEV, Kostadin Dimitrov , YANG, Min-Lun , YANG, Chia-Wei
Abstract: An apparatus may include an ultrasonic sensor stack, a foldable display stack and a transmission enhancement layer. The foldable display stack may include a display stiffener and display stack layers. The display stack layers may form one or more display stack resonators configured to enhance ultrasonic waves transmitted by the ultrasonic sensor stack in a first ultrasonic frequency range. In some implementations, a transmission enhancement resonator may include the display stiffener and the transmission enhancement layer. In some examples, the transmission enhancement resonator may include at least a portion of the ultrasonic sensor stack. The transmission enhancement resonator may be configured to enhance the ultrasonic waves transmitted by the ultrasonic sensor stack in the first ultrasonic frequency range.
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公开(公告)号：WO2020081182A1
公开(公告)日：2020-04-23
申请号：PCT/US2019/051672
申请日：2019-09-18
Applicant: QUALCOMM INCORPORATED
Inventor： LU, Yipeng , PANCHAWAGH, Hrishikesh Vijaykumar , DJORDJEV, Kostadin Dimitrov , SEO, Jae Hyeong , BUCHAN, Nicholas Ian , TSENG, Chin-Jen , KAO, Tsongming
Abstract: An ultrasonic fingerprint sensor system of the present disclosure may be provided with a flexible substrate. The ultrasonic fingerprint sensor system may include a film stack disposed on the flexible substrate that provides acceptable acoustic coupling for fingerprint sensing. The ultrasonic fingerprint sensor system includes a high acoustic impedance layer in an acoustic path of ultrasonic waves through a display. The high acoustic impedance layer can be electrically conductive or electrically nonconductive. In some implementations, the ultrasonic fingerprint sensor system includes an ultrasonic transceiver or an ultrasonic transmitter separate from an ultrasonic receiver.
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公开(公告)号：WO2020150367A1
公开(公告)日：2020-07-23
申请号：PCT/US2020/013703
申请日：2020-01-15
Applicant: QUALCOMM INCORPORATED
Inventor： LU, Yipeng , PANCHAWAGH, Hrishikesh Vijaykumar , DJORDJEV, Kostadin Dimitrov , TSENG, Chin-Jen , BUCHAN, Nicholas Ian , KAO, Tsongming , SEO, Jae Hyeong
IPC: G06K9/00
Abstract: An ultrasonic fingerprint sensor system of the present disclosure may be provided with a thick electrically nonconductive acoustic layer and thin electrode layer coupled to a piezoelectric layer of an ultrasonic transmitter or transceiver. The thick electrically nonconductive acoustic layer may have a high density or high acoustic impedance value, and may be adjacent to the piezoelectric layer. The thin electrode layer may be divided into electrode segments. The ultrasonic fingerprint sensor system may use flexible or rigid substrates, and may use an ultrasonic transceiver or an ultrasonic transmitter separate from an ultrasonic receiver.
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公开(公告)号：WO2017218228A1
公开(公告)日：2017-12-21
申请号：PCT/US2017/035981
申请日：2017-06-05
Applicant: QUALCOMM INCORPORATED
Inventor： BUCHAN, Nicholas Ian , VELEZ, Mario Francisco , TSENG, Chin-Jen , PANCHAWAGH, Hrishikesh Vijaykumar , SAMMOURA, Firas , STROHMANN, Jessica Liu , DJORDJEV, Kostadin Dimitrov , BURNS, David William , FENNELL, Leonard Eugene , ADAY, Jon Gregory
Abstract: A fingerprint sensor device includes a sensor substrate, a plurality of sensor circuits over a first surface of the sensor substrate, and a transceiver layer located over the plurality of sensor circuits and the first surface of the sensor substrate. The transceiver layer includes a piezoelectric layer and a transceiver electrode positioned over the piezoelectric layer. The piezoelectric layer and the transceiver electrode are configured to generate one or more ultrasonic waves or to receive one or more ultrasonic waves. The fingerprint sensor device may include a cap coupled to the sensor substrate and a cavity formed between the cap and the sensor substrate. The cavity and the sensor substrate may form an acoustic barrier.
Abstract translation: 指纹传感器装置包括传感器基板，在传感器基板的第一表面上方的多个传感器电路以及位于多个传感器电路上方和传感器基板的第一表面上的收发器层 。 收发器层包括压电层和位于压电层上的收发器电极。 压电层和收发器电极被配置为产生一个或多个超声波或接收一个或多个超声波。 指纹传感器装置可以包括耦合到传感器衬底的帽和在帽和传感器衬底之间形成的空腔。 腔体和传感器基板可形成声学屏障。
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公开(公告)号：WO2021102381A1
公开(公告)日：2021-05-27
申请号：PCT/US2020/061683
申请日：2020-11-20
Applicant: QUALCOMM INCORPORATED
Inventor： KITCHENS, Jack Conway , SCHNEIDER, John Keith , GOJEVIC, Stephen Michael , BRELOFF, Evan Michael , MIRANTO, James Anthony , BROOKS, Emily Kathryn , JOHN ARCHIBALD, Fitzgerald , STOIANOV, Alexei , KUMAR, Raj , SREERAM, Sai Praneeth , LNU, Nirma , D'SOUZA, Sandeep Louis , BUCHAN, Nicholas Ian , LU, Yipeng , TSENG, Chin-Jen , PANCHAWAGH, Hrishikesh Vijaykumar
Abstract: An apparatus may include a cover layer, a layer of first metamaterial proximate (or in) the cover layer, a light source system configured for providing light to the layer of first metamaterial and a receiver system. The first metamaterial may include nanoparticles configured to create ultrasonic waves when illuminated by light. The receiver system may include an ultrasonic receiver system configured to receive ultrasonic waves reflected from a target object in contact with, or proximate, a surface of the cover layer. The control system may be configured to receive ultrasonic receiver signals from the ultrasonic receiver system corresponding to the ultrasonic waves reflected from the target object and to perform an authentication process and/or an imaging process that is based, at least in part, on the ultrasonic receiver signals.
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Patent Agency Ranking
公开(公告)号：EP4488963A3
公开(公告)日：2025-03-26
申请号：EP24215432.6
申请日：2022-07-06
Applicant: QUALCOMM Incorporated
Inventor： LIN, Shiang-Chi , PANCHAWAGH, Hrishikesh Vijaykumar , STROHMANN, Jessica Liu , LU, Yipeng , TSENG, Chin-Jen , DJORDJEV, Kostadin Dimitrov , YANG, Min-Lun , YANG, Chia-Wei
Abstract: An apparatus may include an ultrasonic sensor stack, a foldable display stack and a transmission enhancement layer. The foldable display stack may include a display stiffener and display stack layers. The display stack layers may form one or more display stack resonators configured to enhance ultrasonic waves transmitted by the ultrasonic sensor stack in a first ultrasonic frequency range. In some implementations, a transmission enhancement resonator may include the display stiffener and the transmission enhancement layer. In some examples, the transmission enhancement resonator may include at least a portion of the ultrasonic sensor stack. The transmission enhancement resonator may be configured to enhance the ultrasonic waves transmitted by the ultrasonic sensor stack in the first ultrasonic frequency range.
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公开(公告)号：WO2022140711A1
公开(公告)日：2022-06-30
申请号：PCT/US2021/072051
申请日：2021-10-27
Applicant: QUALCOMM INCORPORATED
Inventor： STROHMANN, Jessica, Liu , PANCHAWAGH, Hrishikesh, Vijaykumar , LU, Yipeng , TSENG, Chin-Jen , DJORDJEV, Kostadin, Dimitrov
IPC: G06V40/13
Abstract: Various aspects of the present disclosure relate generally to ultrasonic fingerprint sensor. In some aspects, a device may include a flexible display. The device may include an ultrasonic fingerprint sensor that is configured to transmit and receive an ultrasonic signal in an acoustic path through the flexible display. The device may include an acoustics configuration layer that is situated between the display and the ultrasonic fingerprint sensor. The acoustics configuration layer may be configured to optimize a signal strength of the ultrasonic signal based at least in part on a configuration of one or more layers of the flexible display. Numerous other aspects are provided.
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公开(公告)号：WO2019005498A1
公开(公告)日：2019-01-03
申请号：PCT/US2018/037581
申请日：2018-06-14
Applicant: QUALCOMM INCORPORATED
Inventor： PANCHAWAGH, Hrishikesh Vijaykumar , BADGE, Ila Ravindra , LU, Yipeng , DJORDJEV, Kostadin Dimitrov , GANTI, Suryaprakash , TSENG, Chin-Jen , BUCHAN, Nicholas Ian , KAO, Tsongming , FENNELL, Leonard Eugene , SAMMOURA, Firas , STROHMANN, Jessica Liu , BURNS, David William
Abstract: Disclosed are methods, devices, apparatuses, and systems for an under-display ultrasonic fingerprint sensor. A display device may include a platen, a display underlying the platen, and an ultrasonic fingerprint sensor underlying the display, where the ultrasonic fingerprint sensor is configured to transmit and receive ultrasonic waves via an acoustic path through the platen and the display. A light-blocking layer and/or an electrical shielding layer may be provided between the ultrasonic fingerprint sensor and the display, where the light-blocking layer and/or the electrical shielding layer are in the acoustic path. A mechanical stress isolation layer may be provided between the ultrasonic fingerprint sensor and the display, where the mechanical stress isolation layer is in the acoustic path.
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公开(公告)号：EP4488963A2
公开(公告)日：2025-01-08
申请号：EP24215432.6
申请日：2022-07-06
Applicant: QUALCOMM Incorporated
Inventor： LIN, Shiang-Chi , PANCHAWAGH, Hrishikesh Vijaykumar , STROHMANN, Jessica Liu , LU, Yipeng , TSENG, Chin-Jen , DJORDJEV, Kostadin Dimitrov , YANG, Min-Lun , YANG, Chia-Wei
IPC: G06V40/13
Abstract: An apparatus may include an ultrasonic sensor stack, a foldable display stack and a transmission enhancement layer. The foldable display stack may include a display stiffener and display stack layers. The display stack layers may form one or more display stack resonators configured to enhance ultrasonic waves transmitted by the ultrasonic sensor stack in a first ultrasonic frequency range. In some implementations, a transmission enhancement resonator may include the display stiffener and the transmission enhancement layer. In some examples, the transmission enhancement resonator may include at least a portion of the ultrasonic sensor stack. The transmission enhancement resonator may be configured to enhance the ultrasonic waves transmitted by the ultrasonic sensor stack in the first ultrasonic frequency range.
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公开(公告)号：EP3646235A1
公开(公告)日：2020-05-06
申请号：EP18738087.8
申请日：2018-06-14
Applicant: Qualcomm Incorporated
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