公开(公告)号：WO2009041951A1

公开(公告)日：2009-04-02

申请号：PCT/US2007/020985

申请日：2007-09-28

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  LIN, Yen, Hua ,  HE, Rihui ,  WU, Lingling ,  PALMATEER, Lauren ,  HEALD, David

Inventor： LIN, Yen, Hua ,  HE, Rihui ,  WU, Lingling ,  PALMATEER, Lauren ,  HEALD, David

IPC: B81C1/00

CPC classification number: B81C1/00285 ,  B81C1/00674

Abstract: A MEMS device may be package with a desiccant to provide a moisture-free environment. In order to avoid undesirable effects on the MEMS device, the desiccant may be selected or treated so as to be compatible with a particular MEMS device. This treatment may include baking of the desiccant to as to cause outgassing of moisture or other undesirable material. The structure of the MEMS device may also be altered to improve compatibility with particular desiccants.

Abstract translation: MEMS器件可以用干燥剂包装以提供无湿度的环境。 为了避免对MEMS器件的不期望的影响，可以选择或处理干燥剂以便与特定的MEMS器件兼容。 这种处理可以包括烘烤干燥剂，以引起除湿或其它不期望的物质。 还可以改变MEMS器件的结构，以改善与特定干燥剂的相容性。

公开(公告)号：WO2013059006A1

公开(公告)日：2013-04-25

申请号：PCT/US2012/059075

申请日：2012-10-05

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.

Inventor： BOS, Jan ,  HEALD, David ,  LIN, Yen Hua ,  LAI, Yung-Wei ,  LIAO, Jui-Chih ,  TAN, Yoke-Hou ,  TADEPALLI, Nageswara Rao ,  DU, Yan ,  LIU, Jianwei ,  PIETRI, Richard

IPC: B81B3/00 ,  G02B26/00

CPC classification number: G02B26/001 ,  B81B3/0005 ,  B81C1/00285 ,  B81C2201/112

Abstract: This disclosure provides apparatus, systems and methods for manufacturing electromechanical systems (EMS) packages. One method includes making an EMS package that includes an out-gassable anti-stiction coating. The anti-stiction coating may be a solvent that is included within part of a desiccant mixture. In some implementations, the method includes sealing an EMS device into a package and then heating the package using a temperature profile that out-gasses at least a portion of a residual solvent. The method may include an incubation bake cycle to distribute anti stiction material to display elements within the EMS package. The incubation bake cycle may also more evenly distribute contaminants within the EMS package so as to reduce their effects.

Abstract translation: 本公开提供了用于制造机电系统（EMS）封装的装置，系统和方法。 一种方法包括制造包含无气体防粘涂层的EMS包装。 抗静电涂层可以是包含在干燥剂混合物的一部分内的溶剂。 在一些实施方式中，该方法包括将EMS装置密封到包装中，然后使用排出至少一部分残留溶剂的温度曲线来加热包装。 该方法可以包括孵育烘烤循环，以将抗静电材料分配到EMS包装内的显示元件。 温育烘烤循环还可以更均匀地分布EMS包装内的污染物，以减少其影响。

公开(公告)号：WO2009006340A2

公开(公告)日：2009-01-08

申请号：PCT/US2008/068655

申请日：2008-06-27

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  NATARAJAN, Bangalore, R. ,  KHAZENI, Kasra ,  HEALD, David ,  HE, Rihui ,  AKELLA, Sriram ,  GOUSEV, Evgeni

Inventor： NATARAJAN, Bangalore, R. ,  KHAZENI, Kasra ,  HEALD, David ,  HE, Rihui ,  AKELLA, Sriram ,  GOUSEV, Evgeni

IPC: B81C1/00

CPC classification number: B81C1/0092 ,  B81B3/0005 ,  B81B2201/047 ,  B81C2201/112 ,  G02B26/001

Abstract: Methods, devices, and systems provide MEMS devices exhibiting at least one of reduced stiction, reduced hydrophilicity, or reduced variability of certain electrical characteristics using MEMS devices treated with water vapor. The treatment is believed to form one or more passivated surfaces on the interior and/or exterior of the MEMS devices. Relatively gentle temperature and pressure conditions ensure modification of surface chemistry without excessive water absorption after removal of sacrificial material to release the MEMS devices.

Abstract translation: 方法，装置和系统提供使用用水蒸汽处理的MEMS装置展现降低的静摩擦，降低的亲水性或某些电气特性的变化性中的至少一个的MEMS装置。 认为处理在MEMS器件的内部和/或外部形成一个或多个钝化表面。 相对温和的温度和压力条件确保在去除牺牲材料以释放MEMS器件之后，不改变表面化学性质而不过度吸水。

公开(公告)号：WO2008103632A3

公开(公告)日：2008-08-28

申请号：PCT/US2008/054222

申请日：2008-02-18

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  ALAM, Khurshid, Syed ,  HEALD, David

Inventor： ALAM, Khurshid, Syed ,  HEALD, David

IPC: H01L21/00

Abstract: Etching equipment and methods are disclosed herein for more efficient etching of sacrificial material from between permanent MEMS structures. An etching head includes an elongate etchant inlet structure, which may be slot-shaped or an elongate distribution of inlet holes. A substrate is supported in proximity to the etching head in a manner that defines a flow path substantially parallel to the substrate face, and permits relative motion for the etching head to scan across the substrate.

公开(公告)号：WO2009036215A2

公开(公告)日：2009-03-19

申请号：PCT/US2008/076077

申请日：2008-09-11

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  YAN, Xiaoming ,  HO, Chok ,  HEALD, David ,  GOUSEV, Evgeni ,  HERTZLER, Benjamin, W. ,  FLOYD, Philip ,  SASAGAWA, Teruo ,  LONDERGAN, Ana ,  BITA, Ion ,  ZION, Todd

Inventor： YAN, Xiaoming ,  HO, Chok ,  HEALD, David ,  GOUSEV, Evgeni ,  HERTZLER, Benjamin, W. ,  FLOYD, Philip ,  SASAGAWA, Teruo ,  LONDERGAN, Ana ,  BITA, Ion ,  ZION, Todd

IPC: H01L21/311 ,  H01L21/3213 ,  B01D53/68

CPC classification number: H01L21/32135 ,  B01D53/002 ,  B01D2257/11 ,  B01D2257/2027 ,  H01L21/31116

Abstract: The efficiency of an etching process may be increased in various ways, and the cost of an etching process may be decreased. Unused etchant may be isolated and recirculated during the etching process. Etching byproducts may be collected and removed from the etching system during the etching process. Components of the etchant may be isolated and used to general additional etchant. Either or both of the etchant or the layers being etched may also be optimized for a particular etching process.

Abstract translation: 可以以各种方式增加蚀刻工艺的效率，并且可以降低蚀刻工艺的成本。 未蚀刻的蚀刻剂可以在蚀刻过程中被隔离并再循环。 蚀刻副产物可以在蚀刻过程中从蚀刻系统中收集和去除。 蚀刻剂的组分可以被分离并用于一般的另外的蚀刻剂。 蚀刻剂或被蚀刻的层中的任一个或两者也可以针对特定的蚀刻工艺进行优化。

公开(公告)号：WO2008115716A2

公开(公告)日：2008-09-25

申请号：PCT/US2008/056310

申请日：2008-03-07

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  LONDERGAN, Ana, R. ,  NATARAJAN, Bangalore, R. ,  GOUSEV, Evgeni ,  WEBSTER, James, Randolph ,  HEALD, David

Inventor： LONDERGAN, Ana, R. ,  NATARAJAN, Bangalore, R. ,  GOUSEV, Evgeni ,  WEBSTER, James, Randolph ,  HEALD, David

CPC classification number: G02B26/001 ,  B81B3/0008 ,  B81B2201/047

Abstract: Devices, methods, and systems comprising a MEMS device, for example, an interferometric modulator, that comprises a cavity in which a layer coats multiple surfaces. The layer is conformal or non-conformal. In some embodiments, the layer is formed by atomic layer deposition (ALD). Preferably, the layer comprises a dielectric material. In some embodiments, the MEMS device also exhibits improved characteristics, such as improved electrical insulation between moving electrodes, reduced stiction, and/or improved mechanical properties.

Abstract translation: 包括MEMS器件（例如干涉式调制器）的器件，方法和系统，其包括其中层涂覆多个表面的空腔。 该层是保形的或非保形的。 在一些实施例中，该层由原子层沉积（ALD）形成。 优选地，该层包括电介质材料。 在一些实施例中，MEMS器件还表现出改进的特性，例如移动电极之间的改善的电绝缘性，降低的静摩擦力和/或改善的机械性能。

公开(公告)号：EP2104948A2

公开(公告)日：2009-09-30

申请号：EP08714221.2

申请日：2008-02-18

Applicant: QUALCOMM MEMS Technologies, Inc.

Inventor： ALAM, Khurshid, Syed ,  HEALD, David

IPC: H01L21/00

CPC classification number: H01L21/67069 ,  B81B2201/047 ,  B81C1/00531

Abstract: Etching equipment and methods are disclosed herein for more efficient etching of sacrificial material from between permanent MEMS structures. An etching head includes an elongate etchant inlet structure, which may be slot-shaped or an elongate distribution of inlet holes. A substrate is supported in proximity to the etching head in a manner that defines a flow path substantially parallel to the substrate face, and permits relative motion for the etching head to scan across the substrate.

公开(公告)号：EP2021859A1

公开(公告)日：2009-02-11

申请号：EP07755243.8

申请日：2007-04-09

Applicant: QUALCOMM MEMS Technologies, Inc.

Inventor： HEALD, David

IPC: G02B26/00

CPC classification number: G02B26/001

Abstract: A method of fabricating an array of MEMS devices includes the formation of support structures (96) located at the edge of upper strip electrodes (92). A support structure is etched to form a pair of individual support structures (106) located at the edges of a pair of adjacent electrodes (92). The electrodes themselves may be used as a hard mask during the etching of these support structures. A resultant array of MEMS devices includes support structures having a face (107) located at the edge of an overlying electrode and coincident with the edge of the overlying electrode.

公开(公告)号：EP2064148A1

公开(公告)日：2009-06-03

申请号：EP07839031.7

申请日：2007-09-28

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC

Inventor： LIN, Yen Hua ,  HE, Rihui ,  WU, Lingling ,  PALMATEER, Lauren ,  HEALD, David

IPC: B81C1/00

CPC classification number: B81C1/00285 ,  B81C1/00674

Abstract: A MEMS device may be package with a desiccant to provide a moisture-free environment. In order to avoid undesirable effects on the MEMS device, the desiccant may be selected or treated so as to be compatible with a particular MEMS device. This treatment may include baking of the desiccant to as to cause outgassing of moisture or other undesirable material. The structure of the MEMS device may also be altered to improve compatibility with particular desiccants.

公开(公告)号：EP2129619A2

公开(公告)日：2009-12-09

申请号：EP08744820.5

申请日：2008-03-31

Applicant: QUALCOMM MEMS Technologies, Inc.

Inventor： TU, Thanh, Nghia ,  LUO, Qi ,  WEI, Yang, Chia ,  HEALD, David ,  GOUSEV, Evgeni ,  CHIANG, Chih-Wei

IPC: B81C1/00

CPC classification number: B81C1/00476 ,  B81B2201/047

Abstract: Methods of making a micro electromechanical system (MEMS) device are described. In some embodiments, the method includes forming a sacrificial layer over a substrate, treating at least a portion of the sacrificial layer to form a treated sacrificial portion, forming an overlying layer over at least a part of the treated sacrificial portion, and at least partially removing the treated sacrificial portion to form a cavity situated between the substrate and the overlying layer, the overlying layer being exposed to the cavity.