公开(公告)号：WO2013059006A1

公开(公告)日：2013-04-25

申请号：PCT/US2012/059075

申请日：2012-10-05

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.

Inventor： BOS, Jan ,  HEALD, David ,  LIN, Yen Hua ,  LAI, Yung-Wei ,  LIAO, Jui-Chih ,  TAN, Yoke-Hou ,  TADEPALLI, Nageswara Rao ,  DU, Yan ,  LIU, Jianwei ,  PIETRI, Richard

IPC: B81B3/00 ,  G02B26/00

CPC classification number: G02B26/001 ,  B81B3/0005 ,  B81C1/00285 ,  B81C2201/112

Abstract: This disclosure provides apparatus, systems and methods for manufacturing electromechanical systems (EMS) packages. One method includes making an EMS package that includes an out-gassable anti-stiction coating. The anti-stiction coating may be a solvent that is included within part of a desiccant mixture. In some implementations, the method includes sealing an EMS device into a package and then heating the package using a temperature profile that out-gasses at least a portion of a residual solvent. The method may include an incubation bake cycle to distribute anti stiction material to display elements within the EMS package. The incubation bake cycle may also more evenly distribute contaminants within the EMS package so as to reduce their effects.

Abstract translation: 本公开提供了用于制造机电系统（EMS）封装的装置，系统和方法。 一种方法包括制造包含无气体防粘涂层的EMS包装。 抗静电涂层可以是包含在干燥剂混合物的一部分内的溶剂。 在一些实施方式中，该方法包括将EMS装置密封到包装中，然后使用排出至少一部分残留溶剂的温度曲线来加热包装。 该方法可以包括孵育烘烤循环，以将抗静电材料分配到EMS包装内的显示元件。 温育烘烤循环还可以更均匀地分布EMS包装内的污染物，以减少其影响。