公开(公告)号：EP2893783A1

公开(公告)日：2015-07-15

申请号：EP13834789.3

申请日：2013-08-09

Applicant: R&D Circuits Inc.

Inventor： TURPUSEEMA, Dan ,  RUSSELL, James V

IPC: H05K3/06 ,  H05K1/02 ,  H01L21/02

CPC classification number: H05K3/425 ,  H05K1/113 ,  H05K1/115 ,  H05K3/0094 ,  H05K3/243 ,  H05K3/4007 ,  H05K3/427 ,  H05K2201/0959 ,  Y10T29/49156

Abstract: A method and an apparatus for forming a contact pad on a printed circuit board over a filled plate via or blind in which an additional metallic or a non metallic coating is applied to a final surface finished plate which encapsulates the side walls of the wear resistant surface plate, and also covers the side walls of the metal layer plated onto the filled via and the wrap around plated metal which was plated in the via and onto the surface of the base metal to the extents of the pad geometry. This prevents subsequent undermining through the etching process and ensuring the integrity and reliability of the vias' electrical connection when an underlying base metal such as but not limited to copper and the surface plated metal are formed when plating metal in the via and consequently onto the surface.

Abstract translation: 一种用于经由或盲在其中附加金属或非金属涂层在填充板形成的接触焊盘上的印刷电路板的方法和装置应用于最终表面成品板封装了耐磨表面的侧壁 板等覆盖经由镀在填充在金属层和周围的金属镀涡卷其在所述通孔和在基体金属到垫的几何形状的盘区的表面镀覆的侧壁上。 这防止随后通过蚀刻工艺破坏和确保通孔电当一个基础基部金属连接的完整性和可靠性：例如但不限于铜和表面镀覆金属形成当通过并因此在表面上的镀敷金属 ，