公开(公告)号：WO2008066786A3

公开(公告)日：2008-09-12

申请号：PCT/US2007024391

申请日：2007-11-27

Applicant: RAYTHEON CO

Inventor： CARDONA SERGIO E ,  APODACA JERRY E

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0269 ,  H05K3/28 ,  H05K2201/0989 ,  H05K2201/09936 ,  Y10T29/49117

Abstract: A printed circuit board (30). The novel printed circuit board (30) includes a substrate (14), a layer of conductive material (16) disposed on the substrate (14), and a solder mask layer (32) disposed on the conductive layer (16), the solder mask layer (32) including cutouts (34) shaped as reference text and/or art. The conductive layer (16) is etched to form traces for connecting electronic components to be mounted on the board (30) in a desired pattern to form an electrical circuit. The solder mask layer (32) is made from a material that resists wetting by solder and also includes cutouts (22) in areas where the components are to be soldered to the conductive layer (16). The reference text and/or art includes readable information for assembling, testing, and/or repairing the circuit board (30), such as component part numbers, reference designators, pin one identifiers, component outlines, and test point identifiers.

Abstract translation: 印刷电路板（30）。 新颖的印刷电路板（30）包括基板（14），设置在基板（14）上的导电材料层（16）和设置在导电层（16）上的焊料掩模层（32） 掩模层（32），其包括形状为参考文本和/或艺术的切口（34）。 蚀刻导电层（16）以形成用于以期望的图案连接要安装在板（30）上的电子部件以形成电路的迹线。 焊料掩模层（32）由防止焊料润湿的材料制成，并且在部件要被焊接到导电层（16）的区域中还包括切口（22）。 参考文本和/或艺术品包括用于组装，测试和/或修复电路板（30）的可读信息，例如组件部件号，参考指示符，引脚一标识符，组件轮廓和测试点标识符。