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公开(公告)号：WO2014109796A1
公开(公告)日：2014-07-17
申请号：PCT/US2013/055741
申请日：2013-08-20
Applicant: RAYTHEON COMPANY
Inventor： CISCO, Terry C. , HOLTER, Clinton O.
Abstract: Embodiments disclosed include transmission line phase shifters and methods for fabricating transmission line phase shifters that switch signal and ground conductors to reverse electromagnetic fields in a transmission line structure.
Abstract translation: 所公开的实施例包括传输线移相器和用于制造传输线移相器的方法，其将信号和接地导体切换成在传输线结构中反向电磁场。
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2.发明申请IMPROVED FLIP CHIP MMIC ON BOARD PERFORMANCE USING PERIODIC ELECTROMAGNETIC BANDGAP STRUCTURES 审中-公开使用周期性电磁带结构改进板卡MMIC的性能
公开(公告)号：WO2005088708A2
公开(公告)日：2005-09-22
申请号：PCT/US2005/007530
申请日：2005-03-04
Applicant: RAYTHEON COMPANY
Inventor： TONOMURA, Samual D. , CISCO, Terry C. , HOLTER, Clifton Ole
IPC: H01L23/00
CPC classification number: H01L23/552 , H01L23/49838 , H01L23/50 , H01L23/66 , H01L2224/16225 , H01L2224/16237 , H01L2224/81801 , H01L2924/01079 , H01L2924/09701 , H01L2924/1305 , H01L2924/3025 , H01P1/2005 , H05K1/0236 , H05K1/0306 , H05K1/09 , H05K2201/0715 , H05K2201/09336 , H05K2201/09681 , H01L2924/00
Abstract: A hybrid assembly having improved cross talk characteristics comprises a substrate (101) having an upper surface (111). Conductive paths on the upper surface are provided for conducting high frequency signals. Regular polygons (501, 503) made of an electromagnetic band gap (EBG) material having slow wave characteristics are 5 deposited on the upper surface and form a lattice for tessellating the upper surface. Each of the polygons has a periphery. The polygons are separated along their periphery from adjacent polygons by an interspace and are covered with an insulating material. Second polygons (804,808), also made of an electromagnetic band gap material, are deposited over the insulating material. Vias (828) connect second polygons 10 to ground plane(307). Semiconductor structures (404,406) are mounted over the second polygons. The semiconductor structures have a plurality of electrical contacts with the conductive paths. The regular polygons can be hexagons, triangles, octagons or any other combination that forms a lattice and can be printed onto the substrate.
Abstract translation: 具有改进的串扰特性的混合组件包括具有上表面（111）的衬底（101）。 设置上表面的导电路径用于传导高频信号。 由具有慢波特性的电磁带隙（EBG）材料制成的规则多边形（501,503）沉积在上表面上并形成用于镶嵌上表面的格子。 每个多边形都有一个周边。 多边形沿其周边与相邻的多边形间隔开，并被绝缘材料覆盖。 也由电磁带隙材料制成的第二多边形（804,808）沉积在绝缘材料上。 通孔（828）将第二多边形10连接到接地层（307）。 半导体结构（404,406）安装在第二多边形上。 半导体结构具有多个与导电路径的电接触。 正多边形可以是六边形，三角形，八边形或形成网格并可以印刷到基底上的任何其他组合。
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3.发明公开IMPROVED FLIP CHIP MMIC ON BOARD PERFORMANCE USING PERIODIC ELECTROMAGNETIC BANDGAP STRUCTURES 有权改进的倒装芯片MMIC ON BOARD性能使用周期电磁带隙结构
公开(公告)号：EP1721497A2
公开(公告)日：2006-11-15
申请号：EP05745171.8
申请日：2005-03-04
Applicant: RAYTHEON COMPANY
Inventor： TONOMURA, Samual D. , CISCO, Terry C. , HOLTER, Clifton Ole
CPC classification number: H01L23/552 , H01L23/49838 , H01L23/50 , H01L23/66 , H01L2224/16225 , H01L2224/16237 , H01L2224/81801 , H01L2924/01079 , H01L2924/09701 , H01L2924/1305 , H01L2924/3025 , H01P1/2005 , H05K1/0236 , H05K1/0306 , H05K1/09 , H05K2201/0715 , H05K2201/09336 , H05K2201/09681 , H01L2924/00
Abstract: A hybrid assembly having improved cross talk characteristics comprises a substrate (101) having an upper surface (111). Conductive paths on the upper surface are provided for conducting high frequency signals. Regular polygons (501, 503) made of an electromagnetic band gap (EBG) material having slow wave characteristics are 5 deposited on the upper surface and form a lattice for tessellating the upper surface. Each of the polygons has a periphery. The polygons are separated along their periphery from adjacent polygons by an interspace and are covered with an insulating material. Second polygons (804,808), also made of an electromagnetic band gap material, are deposited over the insulating material. Vias (828) connect second polygons 10 to ground plane(307). Semiconductor structures (404,406) are mounted over the second polygons. The semiconductor structures have a plurality of electrical contacts with the conductive paths. The regular polygons can be hexagons, triangles, octagons or any other combination that forms a lattice and can be printed onto the substrate.
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4.发明授权IMPROVED FLIP CHIP MMIC ON BOARD PERFORMANCE USING PERIODIC ELECTROMAGNETIC BANDGAP STRUCTURES 有权改进的倒装芯片MMIC ON BOARD性能使用周期电磁带隙结构
公开(公告)号：EP1721497B1
公开(公告)日：2013-12-18
申请号：EP05745171.8
申请日：2005-03-04
Applicant: RAYTHEON COMPANY
Inventor： TONOMURA, Samual D. , CISCO, Terry C. , HOLTER, Clifton Ole
IPC: H01L23/498 , H01L23/50 , H01L23/552 , H01L23/66 , H05K1/02 , H05K1/03 , H05K1/09 , H01P1/20
CPC classification number: H01L23/552 , H01L23/49838 , H01L23/50 , H01L23/66 , H01L2224/16225 , H01L2224/16237 , H01L2224/81801 , H01L2924/01079 , H01L2924/09701 , H01L2924/1305 , H01L2924/3025 , H01P1/2005 , H05K1/0236 , H05K1/0306 , H05K1/09 , H05K2201/0715 , H05K2201/09336 , H05K2201/09681 , H01L2924/00
Abstract: A hybrid assembly having improved cross talk characteristics includes a substrate having an upper surface. Conductive paths on the upper surface are provided for conducting high frequency signals. Regular polygons made of an electromagnetic band gap (EBG) material having slow wave characteristics are deposited on the upper surface and form a lattice for tessellating the upper surface. Each of the polygons has a periphery. The polygons are separated along their periphery from adjacent polygons by an interspace and are covered with an insulating material. Second polygons, also made of an electromagnetic band gap material, are deposited over the insulating material. Semiconductor structures are mounted over the second polygons. The semiconductor structures have a plurality of electrical contacts with the conductive paths. The regular polygons can be hexagons, triangles, octagons or any other combination that forms a lattice and can be printed onto the substrate.
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