公开(公告)号：WO2021225644A1

公开(公告)日：2021-11-11

申请号：PCT/US2021/013101

申请日：2021-01-12

Applicant: RAYTHEON COMPANY

Inventor： WILSON, James S. ,  SCOTT, Gordon R. ,  GIESEY, James M.

IPC: H05K7/20

Abstract: An apparatus includes a coldplate (104, 200) and a bus bar (204). The coldplate is configured to be thermally coupled to a structure (102) to be cooled and to remove thermal energy from the structure. The bus bar is integrated into the coldplate and is configured to deliver power to multiple components (108a-108b) of the structure. The apparatus may also include multiple mounting holes (202) positioned in rows on the coldplate and configured to mechanically couple the structure to the coldplate, where one of the bus bar or an additional bus bar is integrated between each pair of adjacent rows of mounting holes. The apparatus may further include sealed cooling channels (206) adjacent to the bus bar and each additional bus bar. The bus bar may be integrated into the coldplate using vacuum brazing or ultrasonic additive manufacturing.