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    INTEGRATED ELECTRICAL BUS BARS IN LIQUID COLDPLATE WITH HIGH DENSITY INTERCONNECTS
    1.
    发明申请
    INTEGRATED ELECTRICAL BUS BARS IN LIQUID COLDPLATE WITH HIGH DENSITY INTERCONNECTS 审中-公开

    公开(公告)号：WO2021225644A1

    公开(公告)日：2021-11-11

    申请号：PCT/US2021/013101

    申请日：2021-01-12

    Applicant: RAYTHEON COMPANY

    Inventor： WILSON, James S. ,  SCOTT, Gordon R. ,  GIESEY, James M.

    IPC: H05K7/20

    Abstract: An apparatus includes a coldplate (104, 200) and a bus bar (204). The coldplate is configured to be thermally coupled to a structure (102) to be cooled and to remove thermal energy from the structure. The bus bar is integrated into the coldplate and is configured to deliver power to multiple components (108a-108b) of the structure. The apparatus may also include multiple mounting holes (202) positioned in rows on the coldplate and configured to mechanically couple the structure to the coldplate, where one of the bus bar or an additional bus bar is integrated between each pair of adjacent rows of mounting holes. The apparatus may further include sealed cooling channels (206) adjacent to the bus bar and each additional bus bar. The bus bar may be integrated into the coldplate using vacuum brazing or ultrasonic additive manufacturing.

    SCALABLE THERMAL SOLUTION FOR HIGH FREQUENCY PANEL ARRAY APPLICATIONS OR OTHER APPLICATIONS
    4.
    发明申请
    SCALABLE THERMAL SOLUTION FOR HIGH FREQUENCY PANEL ARRAY APPLICATIONS OR OTHER APPLICATIONS 审中-公开
    适用于高频面板阵列应用或其他应用的可扩展热解决方案

    公开(公告)号：WO2017062095A1

    公开(公告)日：2017-04-13

    申请号：PCT/US2016/045928

    申请日：2016-08-06

    Applicant: RAYTHEON COMPANY

    Inventor： ELLIOTT, James M. ,  WILSON, James S. ,  SWERNOFSKY, David E.

    IPC: H05K1/02

    CPC classification number: H05K1/0204 ,  H05K1/0209 ,  H05K1/142 ,  H05K3/301 ,  H05K2201/066 ,  H05K2201/10242

    Abstract: An apparatus includes a printed circuit board (PCB) (200, 200a-200m, 705) including a surface (205) that has a layer of circuitry (215, 220, 225, 230, 235, 240, 245, 250, 255, 260, 265, 709, 710). The apparatus also includes a heat sink (300) configured to receive heat from the PCB. The apparatus further includes a thermally- conductive post (400, 500, 707) configured to remove the heat from the PCB to the heat sink via thermal conduction through a thermal path. The thermal path is substantially orthogonal to the surface of the PCB. The post includes an end configured to physically couple to the layer of circuitry.

    Abstract translation: 一种装置包括印刷电路板（PCB）（200,200a-200m，705），其包括具有电路层（215,220,225,230,235,240,245,250,255,255,255）的表面（205） 260,265,709,710）。 该设备还包括配置为从PCB接收热量的散热器（300）。 该装置还包括导热柱（400,500,770），其被配置为通过热路径的热传导将热量从PCB去除到散热器。 热路径基本上垂直于PCB的表面。 该柱包括被配置为物理耦合到电路层的端部。

    METAL-DIAMOND COMPOSITE-BASED RADIO FREQUENCY WAVEGUIDE HOUSING
    5.
    发明申请
    METAL-DIAMOND COMPOSITE-BASED RADIO FREQUENCY WAVEGUIDE HOUSING 审中-公开

    公开(公告)号：WO2022265928A1

    公开(公告)日：2022-12-22

    申请号：PCT/US2022/033013

    申请日：2022-06-10

    Applicant: RAYTHEON COMPANY

    Inventor： WORTHEN, Karl L. ,  WILSON, James S. ,  LAMB, Joshua

    IPC: H01P1/04 ,  H01P1/30

    Abstract: A radio frequency (RF) waveguide housing includes a metal-diamond base with a first surface and a second surface opposite the first surface. The metal-diamond base includes an opening through a thickness of the metal-diamond base, and the opening includes a first side on a side of the first surface of the metal-diamond base and a second side on a side of the second surface of the metal-diamond base. The RF waveguide housing also includes an insert to be inserted in the opening and affixed to the metal-diamond base. The insert defines an interior volume within the opening of the metal-diamond base and a shape of the insert at the first side of the opening is configured to match an end of an RF waveguide coupled to the RF waveguide housing.

    BUILDING LIQUID FLOW-THROUGH PLATES
    6.
    发明申请
    BUILDING LIQUID FLOW-THROUGH PLATES 审中-公开

    公开(公告)号：WO2022115219A1

    公开(公告)日：2022-06-02

    申请号：PCT/US2021/057988

    申请日：2021-11-04

    Applicant: RAYTHEON COMPANY

    Inventor： BLAIN, Trae M. ,  WILSON, James S.

    IPC: H01L21/48 ,  H01L23/373 ,  H01L23/473 ,  B23K20/02 ,  H01L23/367

    Abstract: A process for building a high-performance liquid flow-through plate is provided and includes providing a substrate formed of metal matrix composite (MMC) material, metallizing a surface of the substrate to reform the surface into a metallized surface, placing a braze foil on the metallized surface and executing a high-temperature and high-pressure bake whereby material of the braze foil diffuses into the metallized surface.

    TWO-PHASE EXPENDABLE COOLING SYSTEMS WITH PASSIVE FLOW CONTROL MEMBRANES
    7.
    发明申请
    TWO-PHASE EXPENDABLE COOLING SYSTEMS WITH PASSIVE FLOW CONTROL MEMBRANES 审中-公开

    公开(公告)号：WO2019112656A1

    公开(公告)日：2019-06-13

    申请号：PCT/US2018/047937

    申请日：2018-08-24

    Applicant: RAYTHEON COMPANY

    Inventor： WILSON, James S. ,  OCKFEN, Alex E. ,  LOZANO III, Adolfo ,  RICKMAN, Amanda S.

    IPC: F25B19/04 ,  H01L23/427

    Abstract: An apparatus includes a heat sink (110, 310, 510, 610, 706) configured to receive thermal energy from one or more heat sources (102, 202a-202c, 502). The heat sink includes a local reservoir (114) configured to hold a liquid coolant, and the heat sink is configured to pass the thermal energy into the liquid coolant in the local reservoir in order to vaporize at least some of the liquid coolant. The apparatus also includes a membrane (122, 706) configured to allow vaporized coolant to pass through the membrane out of the local reservoir into an ambient environment and to prevent unvaporized coolant from passing through the membrane. The membrane is thereby configured to provide passive flow control for the liquid coolant. The membrane could include a vapor-permeable and liquid-repelling membrane. The membrane can also be configured to hold the liquid coolant in the local reservoir against one or more surfaces of the heat sink.

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