公开(公告)号：WO2022271271A1

公开(公告)日：2022-12-29

申请号：PCT/US2022/027224

申请日：2022-05-02

Applicant: RAYTHEON COMPANY

Inventor： HARKINS, Brian J. ,  MCCORDIC, Craig H. ,  MIKUTEL, John A. ,  BEAULIEU, Mark J.

IPC: G01S7/00 ,  G01S7/02 ,  H01Q3/26 ,  H01Q3/30 ,  H01Q21/00 ,  G01S13/87 ,  G01S2013/0245 ,  G01S7/003 ,  G01S7/027 ,  G01S7/40 ,  H01Q1/02 ,  H01Q1/1242 ,  H01Q21/0025 ,  H01Q21/205 ,  H01Q3/267

Abstract: A modular radar system comprises an antenna assembly, a support structure to which the antenna assembly is mounted, and a set of modular radar subsystems. The antenna assembly comprises an antenna array, an antenna enclosure to which the antenna array is attached and which is configured to house the antenna array and to distribute communications signals and power signals to the antenna array, and an antenna enclosure interface configured to receive inputs to and provide outputs from, the antenna array. The support structure positions the antenna array at an orientation and elevation for antenna operation. The set of modular radar subsystems is separate from the support structure and in operable communication with the antenna enclosure interface and comprises a data processing subsystem, a cooling subsystem, and an AC power subsystem supplying power to the antenna enclosure, the data processing subsystem, the cooling subsystem and to a DC power conversion subsystem.

公开(公告)号：EP4359812A1

公开(公告)日：2024-05-01

申请号：EP22724576.8

申请日：2022-05-02

Applicant: Raytheon Company

Inventor： HARKINS, Brian J. ,  MCCORDIC, Craig H. ,  MIKUTEL, John A. ,  BEAULIEU, Mark J.

IPC: G01S7/00 ,  G01S7/02 ,  H01Q3/26 ,  H01Q3/30 ,  H01Q21/00

CPC classification number: G01S7/003 ,  G01S7/02 ,  H01Q3/26 ,  H01Q21/0025 ,  H01Q21/205 ,  H01Q1/1242 ,  H01Q1/02