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公开(公告)号：WO2016057105A1
公开(公告)日：2016-04-14
申请号：PCT/US2015/043563
申请日：2015-08-04
Applicant: RAYTHEON COMPANY
Inventor： ISOM, Robert S. , KASEMODEL, Justin , ELLIOTT, James M.
CPC classification number: H05K1/14 , H01Q1/50 , H05K1/0213 , H05K1/144 , H05K1/145 , H05K3/366 , H05K2201/10098
Abstract: A transition apparatus for connecting first and second circuit boards is provided. The transition apparatus includes a beam having edges and a length defined between the edges, beam circuitry running along the length of the beam and connections disposed at the edges of the beam to connect the beam circuitry with respective circuitry of the first and second circuit boards at respective interior, opposing surfaces thereof.
Abstract translation: 提供一种用于连接第一和第二电路板的转换装置。 转换装置包括具有边缘和在边缘之间限定的长度的光束，沿着光束的长度延伸的光束电路和设置在光束边缘处的连接，以将光束电路与第一和第二电路板的相应电路连接 各自的内部，相对的表面。
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2.发明申请EXPANDING THERMAL DEVICE AND SYSTEM FOR EFFECTING HEAT TRANSFER WITHIN ELECTRONICS ASSEMBLIES 审中-公开扩展热装置和系统以影响电子组件内的传热
公开(公告)号：WO2017200630A1
公开(公告)日：2017-11-23
申请号：PCT/US2017/020820
申请日：2017-03-03
Applicant: RAYTHEON COMPANY
Inventor： JOHANSEN, Brian W. , KASEMODEL, Justin , ELLIOTT, James M.
IPC: H01L23/427 , H01L23/433
Abstract: Heat transfer devices and systems for thermally coupling electrical components to a heatsink can comprise one or more all-metal heat transfer device(s) thermally coupling at least one electrical component to a heatsink. A heat transfer device can comprise a metal cup attached to a metal heatsink, and a metal piston and a compliant device disposed in the cup. The piston is forcible to a secured first position, upon reflowing solder, while compressing the compliant device. Upon reflowing solder again, the compliant device causes the piston to bias and attach to the electrical component to provide an all-metal thermal path and absorb assembly tolerances to avoid using thermal gap fillers. A method is provided for thermally coupling a heatsink to a plurality of electrical components via a plurality of all-metal, expandable heat transfer devices.
Abstract translation: 用于将电部件热耦合到散热器的传热装置和系统可以包括将至少一个电部件热耦合到散热器的一个或多个全金属传热装置。 传热装置可以包括连接到金属散热器的金属杯，以及设置在杯中的金属活塞和柔顺装置。 在回流焊料时，活塞被强制到固定的第一位置，同时压缩顺应装置。 在再次回流焊接时，柔性装置使活塞偏置并附接到电气部件以提供全金属热路径并吸收组件公差以避免使用热间隙填充物。 提供一种用于经由多个全金属可膨胀传热装置将散热器热耦合到多个电气部件的方法。
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公开(公告)号：EP3205188A1
公开(公告)日：2017-08-16
申请号：EP15753256.5
申请日：2015-08-04
Applicant: Raytheon Company
Inventor： ISOM, Robert S. , KASEMODEL, Justin , ELLIOTT, James M.
CPC classification number: H05K1/14 , H01Q1/50 , H05K1/0213 , H05K1/144 , H05K1/145 , H05K3/366 , H05K2201/10098
Abstract: A transition apparatus for connecting first and second circuit boards is provided. The transition apparatus includes a beam having edges and a length defined between the edges, beam circuitry running along the length of the beam and connections disposed at the edges of the beam to connect the beam circuitry with respective circuitry of the first and second circuit boards at respective interior, opposing surfaces thereof.
Abstract translation: 提供了用于连接第一和第二电路板的转换设备。 该过渡设备包括具有边缘和在边缘之间限定的长度的梁，沿着梁的长度延伸的梁电路和设置在梁的边缘处的连接件，以将梁电路与第一和第二电路板的相应电路 相应的内部，相对的表面。
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4.发明公开
公开(公告)号：EP3459111A1
公开(公告)日：2019-03-27
申请号：EP17713806.2
申请日：2017-03-03
Applicant: Raytheon Company
Inventor： JOHANSEN, Brian W. , KASEMODEL, Justin , ELLIOTT, James M.
IPC: H01L23/427 , H01L23/433
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