公开(公告)号：WO2016057105A1

公开(公告)日：2016-04-14

申请号：PCT/US2015/043563

申请日：2015-08-04

Applicant: RAYTHEON COMPANY

Inventor： ISOM, Robert S. ,  KASEMODEL, Justin ,  ELLIOTT, James M.

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K1/14 ,  H01Q1/50 ,  H05K1/0213 ,  H05K1/144 ,  H05K1/145 ,  H05K3/366 ,  H05K2201/10098

Abstract: A transition apparatus for connecting first and second circuit boards is provided. The transition apparatus includes a beam having edges and a length defined between the edges, beam circuitry running along the length of the beam and connections disposed at the edges of the beam to connect the beam circuitry with respective circuitry of the first and second circuit boards at respective interior, opposing surfaces thereof.

Abstract translation: 提供一种用于连接第一和第二电路板的转换装置。 转换装置包括具有边缘和在边缘之间限定的长度的光束，沿着光束的长度延伸的光束电路和设置在光束边缘处的连接，以将光束电路与第一和第二电路板的相应电路连接 各自的内部，相对的表面。

公开(公告)号：WO2017062095A1

公开(公告)日：2017-04-13

申请号：PCT/US2016/045928

申请日：2016-08-06

Applicant: RAYTHEON COMPANY

Inventor： ELLIOTT, James M. ,  WILSON, James S. ,  SWERNOFSKY, David E.

IPC: H05K1/02

CPC classification number: H05K1/0204 ,  H05K1/0209 ,  H05K1/142 ,  H05K3/301 ,  H05K2201/066 ,  H05K2201/10242

Abstract: An apparatus includes a printed circuit board (PCB) (200, 200a-200m, 705) including a surface (205) that has a layer of circuitry (215, 220, 225, 230, 235, 240, 245, 250, 255, 260, 265, 709, 710). The apparatus also includes a heat sink (300) configured to receive heat from the PCB. The apparatus further includes a thermally- conductive post (400, 500, 707) configured to remove the heat from the PCB to the heat sink via thermal conduction through a thermal path. The thermal path is substantially orthogonal to the surface of the PCB. The post includes an end configured to physically couple to the layer of circuitry.

Abstract translation: 一种装置包括印刷电路板（PCB）（200,200a-200m，705），其包括具有电路层（215,220,225,230,235,240,245,250,255,255,255）的表面（205） 260,265,709,710）。 该设备还包括配置为从PCB接收热量的散热器（300）。 该装置还包括导热柱（400,500,770），其被配置为通过热路径的热传导将热量从PCB去除到散热器。 热路径基本上垂直于PCB的表面。 该柱包括被配置为物理耦合到电路层的端部。

公开(公告)号：WO2017200630A1

公开(公告)日：2017-11-23

申请号：PCT/US2017/020820

申请日：2017-03-03

Applicant: RAYTHEON COMPANY

Inventor： JOHANSEN, Brian W. ,  KASEMODEL, Justin ,  ELLIOTT, James M.

IPC: H01L23/427 ,  H01L23/433

Abstract: Heat transfer devices and systems for thermally coupling electrical components to a heatsink can comprise one or more all-metal heat transfer device(s) thermally coupling at least one electrical component to a heatsink. A heat transfer device can comprise a metal cup attached to a metal heatsink, and a metal piston and a compliant device disposed in the cup. The piston is forcible to a secured first position, upon reflowing solder, while compressing the compliant device. Upon reflowing solder again, the compliant device causes the piston to bias and attach to the electrical component to provide an all-metal thermal path and absorb assembly tolerances to avoid using thermal gap fillers. A method is provided for thermally coupling a heatsink to a plurality of electrical components via a plurality of all-metal, expandable heat transfer devices.

Abstract translation: 用于将电部件热耦合到散热器的传热装置和系统可以包括将至少一个电部件热耦合到散热器的一个或多个全金属传热装置。 传热装置可以包括连接到金属散热器的金属杯，以及设置在杯中的金属活塞和柔顺装置。 在回流焊料时，活塞被强制到固定的第一位置，同时压缩顺应装置。 在再次回流焊接时，柔性装置使活​​塞偏置并附接到电气部件以提供全金属热路径并吸收组件公差以避免使用热间隙填充物。 提供一种用于经由多个全金属可膨胀传热装置将散热器热耦合到多个电气部件的方法。

公开(公告)号：EP3459111A1

公开(公告)日：2019-03-27

申请号：EP17713806.2

申请日：2017-03-03

Applicant: Raytheon Company

Inventor： JOHANSEN, Brian W. ,  KASEMODEL, Justin ,  ELLIOTT, James M.

IPC: H01L23/427 ,  H01L23/433

公开(公告)号：EP3205188A1

公开(公告)日：2017-08-16

申请号：EP15753256.5

申请日：2015-08-04

Applicant: Raytheon Company

Inventor： ISOM, Robert S. ,  KASEMODEL, Justin ,  ELLIOTT, James M.

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K1/14 ,  H01Q1/50 ,  H05K1/0213 ,  H05K1/144 ,  H05K1/145 ,  H05K3/366 ,  H05K2201/10098

Abstract: A transition apparatus for connecting first and second circuit boards is provided. The transition apparatus includes a beam having edges and a length defined between the edges, beam circuitry running along the length of the beam and connections disposed at the edges of the beam to connect the beam circuitry with respective circuitry of the first and second circuit boards at respective interior, opposing surfaces thereof.

Abstract translation: 提供了用于连接第一和第二电路板的转换设备。 该过渡设备包括具有边缘和在边缘之间限定的长度的梁，沿着梁的长度延伸的梁电路和设置在梁的边缘处的连接件，以将梁电路与第一和第二电路板的相应电路 相应的内部，相对的表面。

公开(公告)号：EP3132662A1

公开(公告)日：2017-02-22

申请号：EP15713345.5

申请日：2015-02-18

Applicant: Raytheon Company

Inventor： KYHL, Cary C. ,  HESTON, Scott M. ,  ELLIOTT, James M.

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H05K7/2039 ,  H01L2224/73253 ,  H01L2924/16195 ,  H05K3/303 ,  H05K3/305 ,  H05K3/321 ,  H05K3/3426 ,  H05K2201/1056 ,  H05K2201/10628 ,  H05K2201/10689 ,  Y02P70/613

Abstract: A surface mount device is disclosed. The surface mount device can include an electronic component operable in an electronic circuit. The surface mount device can also include a heat transfer component thermally coupled to the electronic component. The heat transfer component can have a heat transfer surface configured to interface with a heat sink. In addition, the surface mount device can include a resiliently flexible lead to electrically couple the electronic component to a circuit board. The resiliently flexible lead can be configured to resiliently deflect to facilitate a variable distance of the heat transfer surface from the circuit board, to enable the heat transfer surface and a planar heat transfer surface of another similarly configured surface mount device to be substantially aligned for interfacing with the heat sink.

Abstract translation: 公开了一种表面贴装装置。 表面安装装置可以包括可在电子电路中操作的电子部件。 表面安装装置还可以包括热耦合到电子部件的传热部件。 传热部件可以具有配置成与散热器相接合的传热表面。 此外，表面安装装置可以包括弹性柔性引线，以将电子部件电耦合到电路板。 弹性柔性引线可以被配置为弹性偏转，以促进热传递表面与电路板的可变距离，使得热传递表面和另一类似配置的表面安装器件的平面传热表面能够基本上对准用于接口 与散热器。