公开(公告)号：WO2017123319A1

公开(公告)日：2017-07-20

申请号：PCT/US2016/061629

申请日：2016-11-11

Applicant: RAYTHEON COMPANY

Inventor： NEUMANN, Jay R. ,  MCEWAN, Thomas F. ,  SIGURDSON, David E. ,  PEREZ, Alberto ,  LAMBE, Janine F. ,  TRACY, Gregory D.

IPC: H05K3/46 ,  H01P3/08 ,  H04N5/225 ,  H04M1/02 ,  G06F1/18 ,  H05K1/02

CPC classification number: H01B7/04 ,  G06F1/183 ,  G06F13/20 ,  H01L27/14636 ,  H01L27/14652 ,  H01P3/08 ,  H01R12/79 ,  H04N5/2253 ,  H05K1/0203 ,  H05K1/0243 ,  H05K1/0245 ,  H05K1/0284 ,  H05K3/4691 ,  H05K5/0069 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10189 ,  Y02D10/14

Abstract: A rigid-flex assembly (RFA) includes a circuit board (12) attachable to a focal plane sensor (14). The RFA includes a flexible wiring section (18) electrically coupled at opposing ends to the circuit board and to an edge connector (22). The flexible wiring section has a controlled separation distance or volume or vacuum gap between wiring strips for reduction of dielectric electrical loss and electrical cross talk. The flexible section has wires or traces configured to reduce the amount of copper used while optimizing signal integrity. Rigid substrates electrically couple the flexible wiring section to the connector. The RFA uses an end-launch, in-plane connection to the sensor for improved performance. A sensor module includes a housing and a sensor. An RFA is coupled to the sensor for high-speed data transfer and that optimizes signal integrity while providing thermal isolation via the flexible section.

Abstract translation: 刚性 - 柔性组件（RFA）包括可连接到焦平面传感器（14）的电路板（12）。 RFA包括柔性布线部分（18），柔性布线部分（18）在相对端电耦合到电路板和边缘连接器（22）。 柔性布线部分具有可控的分隔距离或布线带之间的体积或真空间隙，以减少介电损耗和电串扰。 柔性部分具有配线或配线以减少所用铜的量，同时优化信号完整性。 刚性基板将柔性配线部分电连接到连接器。 RFA使用终端发射，面内连接到传感器以提高性能。 传感器模块包括壳体和传感器。 RFA与传感器耦合用于高速数据传输，并优化信号完整性，同时通过柔性部分提供热绝缘。

公开(公告)号：EP3403475A1

公开(公告)日：2018-11-21

申请号：EP16805930.1

申请日：2016-11-11

Applicant: Raytheon Company

Inventor： NEUMANN, Jay R. ,  MCEWAN, Thomas F. ,  SIGURDSON, David E. ,  PEREZ, Alberto ,  LAMBE, Janine F. ,  TRACY, Gregory D.

IPC: H05K3/46 ,  H01P3/08 ,  H04N5/225 ,  H04M1/02 ,  G06F1/18 ,  H05K1/02

CPC classification number: H01B7/04 ,  G06F13/20 ,  H01L27/14636 ,  H01L27/14652 ,  H01P3/08 ,  H01R12/79 ,  H04M1/0264 ,  H04N5/2253 ,  H05K1/0203 ,  H05K1/0243 ,  H05K1/0245 ,  H05K1/0284 ,  H05K3/4691 ,  H05K5/0069 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10189 ,  Y02D10/14

Abstract: A rigid-flex assembly (RFA) includes a circuit board attachable to a focal plane sensor. The RFA includes a flexible wiring section electrically coupled at opposing ends to the circuit board and to an edge connector. The flexible wiring section has a controlled separation distance or volume or vacuum gap between wiring strips for reduction of dielectric electrical loss and electrical cross talk. The flexible section has wires or traces configured to reduce the amount of copper used while optimizing signal integrity. Rigid substrates electrically couple the flexible wiring section to the connector. The RFA uses an end-launch, in-plane connection to the sensor for improved performance. A sensor module includes a housing and a sensor. An RFA is coupled to the sensor for high-speed data transfer and that optimizes signal integrity while providing thermal isolation via the flexible section.