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    RIGID-FLEX ASSEMBLY FOR HIGH-SPEED SENSOR MODULES
    1.
    发明申请
    RIGID-FLEX ASSEMBLY FOR HIGH-SPEED SENSOR MODULES 审中-公开
    用于高速传感器模块的刚性 - 挠性组件

    公开(公告)号：WO2017123319A1

    公开(公告)日：2017-07-20

    申请号：PCT/US2016/061629

    申请日：2016-11-11

    Applicant: RAYTHEON COMPANY

    Inventor： NEUMANN, Jay R. ,  MCEWAN, Thomas F. ,  SIGURDSON, David E. ,  PEREZ, Alberto ,  LAMBE, Janine F. ,  TRACY, Gregory D.

    IPC: H05K3/46 ,  H01P3/08 ,  H04N5/225 ,  H04M1/02 ,  G06F1/18 ,  H05K1/02

    CPC classification number: H01B7/04 ,  G06F1/183 ,  G06F13/20 ,  H01L27/14636 ,  H01L27/14652 ,  H01P3/08 ,  H01R12/79 ,  H04N5/2253 ,  H05K1/0203 ,  H05K1/0243 ,  H05K1/0245 ,  H05K1/0284 ,  H05K3/4691 ,  H05K5/0069 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10189 ,  Y02D10/14

    Abstract: A rigid-flex assembly (RFA) includes a circuit board (12) attachable to a focal plane sensor (14). The RFA includes a flexible wiring section (18) electrically coupled at opposing ends to the circuit board and to an edge connector (22). The flexible wiring section has a controlled separation distance or volume or vacuum gap between wiring strips for reduction of dielectric electrical loss and electrical cross talk. The flexible section has wires or traces configured to reduce the amount of copper used while optimizing signal integrity. Rigid substrates electrically couple the flexible wiring section to the connector. The RFA uses an end-launch, in-plane connection to the sensor for improved performance. A sensor module includes a housing and a sensor. An RFA is coupled to the sensor for high-speed data transfer and that optimizes signal integrity while providing thermal isolation via the flexible section.

    Abstract translation: 刚性 - 柔性组件（RFA）包括可连接到焦平面传感器（14）的电路板（12）。 RFA包括柔性布线部分（18），柔性布线部分（18）在相对端电耦合到电路板和边缘连接器（22）。 柔性布线部分具有可控的分隔距离或布线带之间的体积或真空间隙，以减少介电损耗和电串扰。 柔性部分具有配线或配线以减少所用铜的量，同时优化信号完整性。 刚性基板将柔性配线部分电连接到连接器。 RFA使用终端发射，面内连接到传感器以提高性能。 传感器模块包括壳体和传感器。 RFA与传感器耦合用于高速数据传输，并优化信号完整性，同时通过柔性部分提供热绝缘。

    DIRECT READ PIXEL ALIGNMENT
    2.
    发明申请
    DIRECT READ PIXEL ALIGNMENT 审中-公开
    直接读取像素对齐

    公开(公告)号：WO2017176551A1

    公开(公告)日：2017-10-12

    申请号：PCT/US2017/025008

    申请日：2017-03-30

    Applicant: RAYTHEON COMPANY

    Inventor： NEUMANN, Jay R. ,  RANDOLPH, Peter M. ,  FULK, Chad W.

    IPC: H01L27/146

    Abstract: An electro-optical sensor chip assembly (SCA) is provided and includes a read-out integrated circuit (ROIC) (602), a detector (603) including a substrate (6032), a buffer layer (6034), a pixel layer (6036) and an array of pixels disposed in the pixel layer and an interconnect layer (604) interposed between the ROIC and the pixel layer and comprising cold welded interconnect posts (6041) respectively extendible to the ROIC from the pixels. The detector is penetrable by visible wavelength light propagating from a direct view window (605) formed in the substrate and the buffer layer to one or more of the pixels.

    Abstract translation: 提供了一种光电传感器芯片组件（SCA），其包括读出集成电路（ROIC）（602），包括衬底（6032）的检测器（603），缓冲层 （6034），设置在所述像素层中的像素阵列（6036）和像素阵列以及介于所述ROIC和所述像素层之间的互连层（604），并且包括可分别从所述ROIC延伸至所述ROIC的冷焊接互连柱（6041） 像素。 检测器可被可见光波长的光穿透，该可见波长光从在衬底和缓冲层中形成的直视窗（605）传播到一个或多个像素。

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