公开(公告)号：WO2020112311A1

公开(公告)日：2020-06-04

申请号：PCT/US2019/059789

申请日：2019-11-05

Applicant: RAYTHEON COMPANY

Inventor： MARTINEZ, Sergio V. ,  OGORZALEK, Jeffrey R. ,  LOTT, Patrick J.

IPC: H05K3/12 ,  H01L23/00 ,  H05K3/34

Abstract: A method (400) for depositing a material (106) to join two surfaces of an electronic assembly includes determining, using dimensions of a pad area (102) of a substrate (100), a deposition pattern for the material that extends across the pad area of the substrate. The method further includes creating a tool (200) to deposit the material in the deposition pattern that extends across the pad area of the substrate.

公开(公告)号：EP4216683A1

公开(公告)日：2023-07-26

申请号：EP23161444.7

申请日：2019-11-05

Applicant: Raytheon Company

Inventor： MARTINEZ, Sergio V. ,  OGORZALEK, Jeffrey R. ,  LOTT, Patrick J.

IPC: H05K3/12 ,  H01L23/00 ,  H05K3/34 ,  H05K3/32 ,  H01L21/48 ,  H01L23/498

Abstract: A method (400) for depositing a material (106) to join two surfaces of an electronic assembly includes determining, using dimensions of a pad area (102) of a substrate (100), a deposition pattern for the material that extends across the pad area of the substrate. The method further includes creating a tool (200) to deposit the material in the deposition pattern that extends across the pad area of the substrate.

公开(公告)号：EP3888428A1

公开(公告)日：2021-10-06

申请号：EP19809695.0

申请日：2019-11-05

Applicant: Raytheon Company

Inventor： MARTINEZ, Sergio V. ,  OGORZALEK, Jeffrey R. ,  LOTT, Patrick J.

IPC: H05K3/12 ,  H01L23/00 ,  H05K3/34