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公开(公告)号:US2929885A
公开(公告)日:1960-03-22
申请号:US35612853
申请日:1953-05-20
Applicant: RCA CORP
Inventor: MUELLER CHARLES W
IPC: H04R23/00
CPC classification number: H04R23/006
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公开(公告)号:US3166694A
公开(公告)日:1965-01-19
申请号:US2031360
申请日:1960-04-06
Applicant: RCA CORP
Inventor: MUELLER CHARLES W
IPC: H01L21/00 , H01L21/306 , H01L29/00
CPC classification number: H01L21/00 , H01L21/30604 , H01L29/00
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公开(公告)号:US2870050A
公开(公告)日:1959-01-20
申请号:US66791657
申请日:1957-06-25
Applicant: RCA CORP
Inventor: MUELLER CHARLES W , PRINTON JANE M
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4.
公开(公告)号:US2825667A
公开(公告)日:1958-03-04
申请号:US50742155
申请日:1955-05-10
Applicant: RCA CORP
Inventor: MUELLER CHARLES W
CPC classification number: C30B31/04 , H01L21/00 , Y10S438/92 , Y10T428/12528
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5.Beam deflection tube having parallel focusing and beam defining plates 失效
Title translation: 梁偏转管具有平行聚焦和光束限定板公开(公告)号:US2434713A
公开(公告)日:1948-01-20
申请号:US56133944
申请日:1944-11-01
Applicant: RCA CORP
Inventor: MUELLER CHARLES W
IPC: H01J21/14
CPC classification number: H01J21/14 , H01J2893/0029
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公开(公告)号:US3208924A
公开(公告)日:1965-09-28
申请号:US9642261
申请日:1961-03-17
Applicant: RCA CORP
Inventor: MUELLER CHARLES W
IPC: C25F3/12 , H01L21/00 , H01L21/3063 , H01L21/308 , H01L29/00
CPC classification number: H01L21/00 , C25F3/12 , H01L21/3063 , H01L21/3081 , H01L29/00 , Y10S438/979
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公开(公告)号:US2967344A
公开(公告)日:1961-01-10
申请号:US71539358
申请日:1958-02-14
Applicant: RCA CORP
Inventor: MUELLER CHARLES W
IPC: H01L21/00 , H01L21/306 , H01L29/00
CPC classification number: H01L21/00 , H01L21/30604 , H01L29/00
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8.Semi-conductor devices with alloyed conductivity-type determining substance 失效
Title translation: 具有合金化导电型确定物质的半导体器件-
公开(公告)号:US2781480A
公开(公告)日:1957-02-12
申请号:US37164853
申请日:1953-07-31
Applicant: RCA CORP
Inventor: MUELLER CHARLES W
IPC: H01L25/07
CPC classification number: H01L25/074 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
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公开(公告)号:CA1024267A
公开(公告)日:1978-01-10
申请号:CA222356
申请日:1975-03-18
Applicant: RCA CORP
Inventor: MUELLER CHARLES W , DOUGLAS EDWARD C
IPC: H01L29/73 , H01L21/00 , H01L21/331 , H01L21/762 , H01L21/86 , H01L27/00 , H01L29/00 , H01L21/265
Abstract: A planar bipolar transistor is made by the successive ion implantations of selected atoms into selected regions of a layer of doped single-crystal silicon on an insulating substrate, such as sapphire or spinel. The silicon layer is epitaxially grown, has a thickness of between 0.5 and 5 mu m, and is formed in two strata of different resistivities. A collector contact well is ion implanted into the upper stratum and annealed to diffuse it into the lower stratum of lower resistivity. The transistor is isolated, as a mesa, on the substrate; and an edge-guard region is ion implanted through the periphery of the mesa, except in the region of the emitter-base junction.
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