公开(公告)号：WO1990012127A1

公开(公告)日：1990-10-18

申请号：PCT/US1990001606

申请日：1990-03-26

Applicant: RD CHEMICAL COMPANY

Inventor： RD CHEMICAL COMPANY ,  MOMBRUN, Suzette, L. ,  SEDLAK, Rudolf, P.

IPC: C23C22/00

CPC classification number: H05K3/385 ,  C23C22/63 ,  H05K3/4611 ,  H05K2203/0315

Abstract: Black, brown, and red oxide layers having high adhesion and peel strength are formed on printed circuit boards by adding a suitable amphipathic anionic surfactant to standard oxidizing solutions. The oxide layers thus formed result in multilayer circuit boards having reduced tendency to delaminate.

公开(公告)号：WO1992003592A1

公开(公告)日：1992-03-05

申请号：PCT/US1991005718

申请日：1991-08-12

Applicant: RD CHEMICAL COMPANY

Inventor： RD CHEMICAL COMPANY ,  BOARTS, Charlene ,  SEDLAK, Rudolf, P. ,  MOMBRUM, Suzette, L.

IPC: C23C22/00

CPC classification number: C23C22/63 ,  H05K3/381 ,  H05K3/385 ,  H05K3/4611 ,  H05K2203/0315

Abstract: Black, brown, and red oxide layers having high adhesion and peel strength are formed on printed circuit boards by adding a suitable amphipathic anionic or amphoteric surfactant to standard oxidizing solutions. The oxide layers thus formed result in multilayer circuit boards having reduced tendency to delaminate.

Abstract translation: 通过向标准氧化溶液中加入合适的两性阴离子或两性表面活性剂，在印刷电路板上形成具有高附着力和剥离强度的黑色，棕色和红色氧化物层。 由此形成的氧化物层导致多层电路板具有降低的分层倾向。

公开(公告)号：WO1996011751A1

公开(公告)日：1996-04-25

申请号：PCT/US1995013162

申请日：1995-10-16

Applicant: RD CHEMICAL COMPANY

Inventor： RD CHEMICAL COMPANY ,  SEDLAK, Rudolf, P.

IPC: B05D05/12

CPC classification number: C23C18/42 ,  H05K3/244

Abstract: The invention features a composition for immersion plating comprising an aqueous solution of a noble metal salt and a complexing agent for ions of the noble metal, said solution having a pH of from about 0 to 5.5. The noble metal is preferably palladium in the form of palladium nitrate. The complexing agent is preferably oxalic acid. The composition is used in a method of immersion plating which comprises contacting a substrate which is preferably a copper or copper alloy component of a printed circuit board with the composition for a period of time sufficient to coat palladium onto the copper surface in a uniform manner. The methodology provides for a high degree of uniformity, good adhesion between the palladium and the copper as well as a relatively thin coating. Further, the palladium coating is carried out in a relatively short period of time and provides a longlived solderable finish.

Abstract translation: 本发明的特征在于用于浸镀的组合物，其包含贵金属盐的水溶液和用于贵金属离子的络合剂，所述溶液的pH为约0至5.5。 贵金属优选为硝酸钯形式的钯。 络合剂优选为草酸。 该组合物用于浸镀方法中，该方法包括将印刷电路板的铜或铜合金组分的基底与该组合物接触足够长的时间以将铜以均匀的方式涂覆在铜表面上。 该方法提供了高度均匀性，钯和铜之间的良好粘合性以及较薄的涂层。 此外，钯涂层在相当短的时间内进行，并且提供了长期的可焊接光洁度。