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    ELEMENTO DE CALENTAMIENTO CON RESISTENCIA CON PELICULA DELGADA DE GRAN AREA, Y METODO.
    4.
    发明专利
    ELEMENTO DE CALENTAMIENTO CON RESISTENCIA CON PELICULA DELGADA DE GRAN AREA, Y METODO. 未知

    公开(公告)号：MX9700728A

    公开(公告)日：1997-09-30

    申请号：MX9700728

    申请日：1995-07-25

    Applicant: THERMAL DAYNAMICS U S A LTD CO

    Inventor： COOPER RICHARD P

    IPC: H05B3/20 ,  A21B1/22 ,  F24C7/04 ,  F24C7/06 ,  H05B3/16 ,  H05B3/26 ,  H05B3/28 ,  H05B03/16 ,  A21B02/00 ,  B05D05/12

    Abstract: Un elemento de calentamiento con resistencia, la película delgada y granárea (21, 46, 81) incluyendo un substrato relativamente rígido (22, 63, 82), que retendrá sus propiedades mecánicas a temperaturas elevadas, una película eléctricamente conductora (26, 64, 84) depositada en el substrato (21, 46, 81), y terminales eléctricas (31, 66, 86) que se proporcionan en la película (26, 64, 84). Un substrato metálico (22, 63), tal como una hoja de acero , que tiene una capa basada en cerámica electricamente aislante (23, 62, 83) puede emplearse encima, o en forma alterna, una hoja o placa de micanite (61) puede emplearse. El substrato y película tienen una área que es suficientemente grande de manera tal que el calentador puede operar a temperaturas máximas sobre 38 degree C (100 degree F) con una densidad de energía menor a aproximadamente 15 watts por 6.45 cm cuadrados (pulgada cuadrada). La película eléctricamente conductora de preferencia es una película de oxido de metal tal como oxido de estaño, y se emplea como un calentador con resistencia en aplicaciones tales como hornos (41) y calentadores de espacio (81) para permitir suministro de energía para mayor eficiencia.

    Production of dielectric insulation layers upon electrical conductors
    5.
    发明公开
    Production of dielectric insulation layers upon electrical conductors 失效
    在电导体上制造介电绝缘层

    公开(公告)号：EP0157494A3

    公开(公告)日：1987-07-01

    申请号：EP85301358

    申请日：1985-02-28

    Applicant: NORTHERN TELECOM LIMITED

    Inventor： Shannon, Michael Allan

    IPC: H01B13/28 ,  H01B13/16 ,  B05D05/12

    CPC classification number: H01B13/287 ,  H01B13/16

    Abstract: ©7 Providing an electrical conductor (10) with an insulation layer having a layer of dielectric carrier with magnetically permeable particles dispersed within the carrier, in which homogeneity is maintained in a fluid mixture (18) of a fluid carrier and the particles, the conductor is moved vertically through a die means (16) to coat it with a fluid layer of the mixture, the fluid carrier is dried and thickness of the dried insulation layer is controlled. This control is achieved by monitoring the thickness or diameter of the dried layer and, if a variation exists between the monitored and required values, the rate of fluid flow through the die means is adjusted to adjust the monitored values towards that required.

    Production of insulated electrical conductors
    7.
    发明公开
    Production of insulated electrical conductors 失效
    绝缘电导体的生产

    公开(公告)号：EP0157495A3

    公开(公告)日：1987-07-08

    申请号：EP85301359

    申请日：1985-02-28

    Applicant: NORTHERN TELECOM LIMITED

    Inventor： Shannon, Michael Allen ,  Manders, Steven Donald

    IPC: H01B13/28 ,  H01B13/16 ,  B05D05/12

    CPC classification number: H01B13/16 ,  H01B13/287

    Abstract: In providing a dried insulation layer (46) upon conductor (12), a covering fluid layer (46) is initially provided by a process and apparatus in which the layer is formed from composite material (24) comprising magnetically permeable particles homogeneously mixed with a fluid carrier. The fluid layer is formed by passing the conductor through a reservoir of the material and then vertically through a die (26, 64). The reservoir of fluid applies pressure atthe die orifice and this pressure is adjustable to vary the rate at which the material passes through the orifice and thus varies the diameter. This pressure is controllable by adjusting the height of the reservoir above a die orifice or by adjusting gas pressure acting downwardly upon the material. The diameter of the layer is advantageously measured after it is dried and variation in measured diameter from that desired effects a change in pressure to alter the diameter towards that desired. The diameter of the layer may, however, be measured with the layer in fluid form.

    FLAME RETARDANT EPOXY MOLDING COMPOUND
    9.
    发明申请
    FLAME RETARDANT EPOXY MOLDING COMPOUND 审中-公开
    阻燃环氧模塑料

    公开(公告)号：WO1994020224A1

    公开(公告)日：1994-09-15

    申请号：PCT/US1994002393

    申请日：1994-03-01

    Applicant: THE DEXTER CORPORATION

    Inventor： THE DEXTER CORPORATION ,  GALLO, Anthony, A.

    IPC: B05D05/12

    CPC classification number: H01L23/293 ,  C08G59/30 ,  C08K3/22 ,  C08L63/00 ,  H01L2924/0002 ,  Y10T428/31511 ,  C08L61/04 ,  H01L2924/00

    Abstract: A flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a halogen (which can be part of the resin or the hardener), and an oxidizing refractory metal oxide, preferably an oxidizing metal oxide of an element selected from the Group VIA of the Periodic Table. The flame retardant epoxy molding compounds when used to encapsulate semiconductor devices have synergistic flame retardant properties.

    Abstract translation: 阻燃性环氧树脂模塑料包括环氧树脂，优选酚醛清漆或酸酐型的硬化剂，催化剂，脱模剂，优选填料，优选着色剂，优选偶联剂，含有卤素的有机化合物（其可以 作为树脂或固化剂的一部分）和氧化性难熔金属氧化物，优选选自元素周期表第VIA族元素的氧化性金属氧化物。 用于封装半导体器件的阻燃环氧模塑料具有协同的阻燃性能。

    LAYERED CHIP STRUCTURE
    10.
    发明申请
    LAYERED CHIP STRUCTURE 审中-公开
    层状芯片结构

    公开(公告)号：WO1993019857A1

    公开(公告)日：1993-10-14

    申请号：PCT/US1993002990

    申请日：1993-03-30

    Applicant: VISTATECH CORPORATION

    Inventor： VISTATECH CORPORATION ,  RAINWATER, Jewel, G.

    IPC: B05D05/12

    CPC classification number: H01L21/67236 ,  H01G4/308 ,  H01L21/4857 ,  H01L21/4867 ,  H05K3/4664

    Abstract: A method for making a substrate for use in a multilayered integrated circuit or multichip module which includes coating a conductive material (14) on a surface of a support sheet (10) to form a conductive circuit (12) and then drying the sheet. Next, a coating of a layer of dielectric layer (18) is placed on the support surface in the areas where the conductive material is not cast. After which the coated sheet is densified to form a densified conductive circuit embedded dielectric layer. A second coating of a dielectric (28) is placed over the first densified conductive circuit embedded dielectric layer such that the second layer is characterized by vias (30) therein which are in register with at least a portion of the conductive circuit (12). The vias in the second dielectric layer are filled to form electrically conductive vias and then densified to form the substrate (44).

    Abstract translation: 一种制造用于多层集成电路或多芯片模块的衬底的方法，包括在支撑片（10）的表面上涂覆导电材料（14）以形成导电电路（12），然后干燥片材。 接下来，将电介质层（18）的涂层放置在导电材料不被铸造的区域中的支撑表面上。 之后，将被覆层片致密化，形成致密化的导电电路嵌入介质层。 电介质（28）的第二涂层被放置在第一致密化的导电电路嵌入介电层上，使得第二层的特征在于其中与导电电路（12）的至少一部分对准的通孔（30）。 填充第二电介质层中的通孔以形成导电通孔，然后致密化以形成衬底（44）。

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