公开(公告)号：US10923365B2

公开(公告)日：2021-02-16

申请号：US16658185

申请日：2019-10-21

Applicant: RichWave Technology Corp.

Inventor： Chia-Yun Wu ,  Yu-Ling Chiu ,  Tsyr-Shyang Liou

IPC: H01L21/56 ,  H01L21/477 ,  H01L23/00 ,  H01L23/31 ,  H01L23/488

Abstract: A method for forming a connection structure is disclosed. A semiconductor structure having a first pad and a bump respectively on a bottom surface thereof is provided. A carrier having a second pad on a top surface thereof is provided. The second pad corresponds to the bump. An epoxy portion is disposed onto the second pad of the carrier. A diameter of the epoxy portion is less than or equal to a diameter of the bump. After depositing the epoxy portion, the bump is attached to the second pad via the epoxy portion.

公开(公告)号：USRE46540E1

公开(公告)日：2017-09-05

申请号：US14464441

申请日：2014-08-20

Applicant: RICHWAVE TECHNOLOGY CORP.

Inventor： Yu-Ling Chiu ,  Tsyr-Shyang Liou

IPC: H04B1/28 ,  H01L21/00 ,  H04B1/46 ,  H04B1/38

CPC classification number: H04B1/38 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A method and an apparatus for integrating a surface acoustic wave (SAW) filter and a transceiver are provided to solve the problem of having a large area of the prior-art integration of a SAW filter and a transceiver; wherein a device for integrating a SAW filter and a transceiver is provided and a component stack method is used to accomplish the integration of the SAW filter and the transceiver, and thus besides featuring a low cost and a small area as well as avoiding a signal loss, the invention can further include a design of encapsulating other components and chips, or even suitable to be used for various integrated circuit packaging technologies (such as QFP and BGA, etc.)